• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Battery Power
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • 5G
    • Automotive/Transportation
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Handbooks
    • EE Training Days
    • Tutorials
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • White Papers
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • DesignFast
  • Videos
    • EE Videos and Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Bill’s Blogs
  • Advertise
  • Subscribe

First vendors through door for DOCSIS 3.0 qualification

December 19, 2007 By Mike Robuck

In what CableLabs is calling a “major milestone,” Casa Systems, Arris and Cisco have become the first companies to earn DOCSIS 3.0 qualification status.

In order to speed up DOCSIS 3.0 rollouts and encourage vendors to submit gear for testing more quickly, CableLabs implemented a tiered test program earlier this year for cable modem termination systems (CMTSs). In a recently completed test wave, start-up Casa Systems received a “silver” qualification for its CMTS, while Arris and Cisco both earned “bronze” qualifications for their CMTS gear.

Faced with increased broadband speeds from the likes of Verizon’s fiber-based FiOS service, cable operators have been clamoring for more speed. DOCSIS 3.0 specifications enable downstream data rates of 160 Mbps or higher and upstream data rates of 120 Mbps or higher.

“This technological achievement is a great step for our industry,” said Comcast CEO and Chairman Brian L. Roberts, who is also chairman of the CableLabs board, in a prepared statement. “CableLabs’ rapid certification effort will enable companies to begin to develop products that will support the rapid deployment of DOCSIS 3.0 services in 2008.”

To achieve these higher data rates, DOCSIS 3.0 describes a methodology for channel bonding in both the upstream and downstream directions. A minimum of four channels, each with throughput of 40 Mbps, is specified.

DOCSIS 3.0 also incorporates support for the Internet Protocol version 6 (IPv6). IPv6 is the next generation of IP and greatly expands the number of Internet addresses that cable operators may use, allowing them to provide consumers with more IP-based services. Comcast, in particular, has expressed a need for additional IP addresses as it provisions more devices.

Full DOCSIS 3.0 compliance will ultimately be the sole certification level for CMTS vendors once the silver and bronze levels of qualifications are phased out.

You Might Also Like

Filed Under: Wire and Cable Tips

Primary Sidebar

EE Engineering Training Days

engineering

Featured Contributions

Five challenges for developing next-generation ADAS and autonomous vehicles

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

GaN reliability milestones break through the silicon ceiling

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

More Featured Contributions

EE Tech Toolbox

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE Learning Center

EE Learning Center
“ee
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills
contribute

R&D World Podcasts

R&D 100 Episode 10
See More >

Sponsored Content

Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

Connectors Enabling the Evolution of AR/VR/MR Devices

Award-Winning Thermal Management for 5G Designs

Making Rugged and Reliable Connections

Omron’s systematic approach to a better PCB connector

Looking for an Excellent Resource on RF & Microwave Power Measurements? Read This eBook

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • Getting different output for op amp circuit
  • Mean offset increase in post-layout simulation of clocked comparator
  • dc-dc converter in series
  • Testing 5kW Grid Tied inverter over 200-253VAC
  • Wireless microphone reviews

RSS Current Electro-Tech-Online.com Discussions

  • Back to the old BASIC days
  • using a RTC in SF basic
  • what's it's name
  • What is correct names for GOOD user friendly circuit drawing program?
  • Curved lines in PCB design
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Teardown Videos
  • Advertise with us
  • Contact us
  • About Us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy