The High Density Packaging (HDP) User Group announced the launch of its second edition of Board Mounted Power Supply (BMPS) Application Guidelines. First, launched in March 2007, it was designed to support the communications and electronics manufacturing industry by promoting better understanding of BMPS products. Since then major users and manufacturers of BMPS products, have continued working to define the market’s requirements and understandings with respect to these products.
The new edition has significant improvements in areas such as Cooling, Digital Power, Energy efficiency, High Voltage Distribution, Lead-free Soldering, Point-of-Load, Remote Powering, and Total Cost of Ownership.