The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2019 in Anaheim, Calif. titled, “Making Power Sources Small with 3D Power Packaging.” Featuring speakers from leading industry and research organizations, the session (IS12) will present an up-to-date look at current and future component and manufacturing technologies utilizing high-density 3D packaging. The session will take place on Wednesday afternoon, March 20th, 2018, from 2:00 – 5:25 p.m. in Room 210A of the Anaheim Convention Center.
Manufacturers utilizing power sources in their products are continually asking for smaller solutions. The industry can deliver with new components, design and manufacturing techniques that support higher density, higher reliability, and higher frequency operation. A 3D packaging approach using embedded components (actives and passives) combined with advanced manufacturing technologies is proving to be the most reliable solution, offering the fastest time to market for achieving increased power density in a smaller footprint. This solution is already in production in semiconductor, component and power supply designs.
The 3D Power Packaging Industry Session will feature seven invited experts, offering application details, real-world examples of implementation and insights to help attendees identify potential opportunities for their companies and to explore the potential of applying this emerging technology to meet their market demands.
Co-chairs of the session, Ernie Parker of Crane of Aerospace & Electronics and Brian Narveson of Narveson Consulting, encourage industry professionals to attend the Industry Session on 3D power packaging. Parker stated: “This session will provide a valuable opportunity to meet other professionals who are active in the evolving design, reliability and manufacturing of 3D embedded components in sub-assembly and power supply designs.” Narveson added: “The 3D Power Packaging Industry Sessions at APEC over the past few years have been well attended and have earned high marks in survey results.”
All APEC attendees are invited to attend the PSMA Packaging Committee meeting scheduled for Wednesday, March 20th, 2019, from 8:00 am to 10:00 am in the Anaheim Marriott, Meeting Room Platinum 9. Participants are also encouraged to participate the other PSMA-sponsored meetings being held throughout the week.