The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping advanced Smart Driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles. The MTP integrates a central processing module based on the just-launched Telemaco3P secure automotive-telematics processor and a comprehensive set of automotive-connectivity devices both on the board and in plug-in modules, ensuring development flexibility and extensibility.
At the core of the MTP is ST’s Telemaco3P device, the industry’s first automotive processor to include a dedicated Hardware Security Module to provide state-of-the-art on-chip security.
The MTP also integrates ST’s automotive-grade multi-constellation GNSS Teseo IC with dead-reckoning sensors and the Telemaco3P’s integrated advanced automotive security module can be further enhanced with an optional on-board ST33 Secure Element. In addition, the platform supports connecting automotive buses such as CAN, FlexRay, and BroadR-Reach® (100Base-T1) to the board directly, and optional Bluetooth™ low energy, Wi-Fi, and LTE modules offer access to wireless networks. Designed for advanced automotive telematics use cases including remote diagnostics and secure Electronic-Control-Unit (ECU) Firmware Over The Air (FOTA) updating, the MTP includes extension connectors for V2X and precise positioning modules, too.
More information: ST Microelectronics, 2755 Great America Way, Santa Clara, CA 95054; (408) 919-8400.
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