TE Connectivity (TE) introduced its new 124 position Sliver internal I/O connectors and cable assemblies, which provide a high density solution that enables up to x20 signal transmission lanes, or 40 differential pairs. The 124 position Sliver connectors currently support PCIe Gen 4 and Gen 5, Ethernet 56G and SAS-5. The cable assemblies currently support […]
Poke-In Connectors for Smart Home Wall-Mounted Devices
TE Connectivity (TE) is introducing BUCHANAN WireMate Two-Piece Poke-In connectors to provide designers with a three-directional mounting solution for wall-mounted devices. The product features a panel mounted, poke-in style terminal block and a mating blade-style header to be attached to the PCB in the device. This two-piece combination allows for installation mounting to be “push-on” […]
Side Exit Power Cable Assemblies Improve Design Flexibility
Multi-Sensor Module Development Kit Accelerates Customer Prototyping
TE Connectivity (TE) announced general availability of AmbiMate MS4 sensor module development kits. The kits allow global engineering and development teams to build prototypes and evaluation boards for systems incorporating TE’s state-of-the-art AmbiMate MS4 Series sensor modules. “We are seeing lighting and building controls companies around the world moving quickly to incorporate sensors into their […]
Connectors Deliver High Current Density In Common Industry Footprint
TE Connectivity (TE) introduced its ELCON Micro power connectors, which deliver high current density in a commonly used industry footprint of 3.0mm. The new connectors provide 12.5A per pin, making them useful for servers, switches, storage devices and testing machines. By using a common industry footprint, TE’s ELCON Micro power connectors allow for easy upgrades to […]
Extra Large Array Socket Technology For Next-Gen Data Centers
TE Connectivity (TE) introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers. The utilization of printed circuit board (PCB) substrates versus […]
New 48 V Bus Bar Connectors And Cable Assemblies
TE Connectivity (TE) announced its new 48V bus bar connectors and cable assemblies, designed to meet next-generation 48V application requirements including the Open Compute Project (OCP) Open Rack Standard V2.0 designs. These products will be showcased for the first time at TE’s booth during the OCP Summit in San Jose, CA on March 20 and […]
Stacked Belly-To-Belly Cages Reduce High-Density Switch Design Costs
TE Connectivity (TE) announced its zQSFP+ stacked belly-to-belly cages, which support a single printed circuit board (PCB) architecture (versus two PCBs) in each line card, saving customers significant costs. Designed for high-density switches with 48 or 64 silicon port designs, TE’s new zQSFP+ stacked belly-to-belly cagesaddress the requirements for higher density switch designs, including Open Compute […]
High Density Power Card Edge Solution For Data Centers
TE Connectivity (TE) announced its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications. TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25A/contact with low resistance, and supports 1500-2000W power supplies for data […]