The IEEE Electronic Components and Technology Conference (ECTC) has announced a Call for Papers for ECTC 2025, the conference’s 75th anniversary. The 75th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers, and business people from more than 20 countries are expected to […]
Events
OFC 2024: How AI and silicon photonics will drive network test
EE World spoke with Sarah Boen, Director of Technology and ASIC Strategy at Tektronix, who spoke at a panel session on how AI and silicon photonics are changing networks and the challenges facing test engineers and reliability engineers.
AI, silicon photonics push networks and test
EE World spoke with Sarah Boen, Director of Technology and ASIC Strategy at Tektronix, who spoke at a panel session on how AI and silicon photonics are changing networks and the challenges facing test engineers and reliability engineers. In OFC 2024: It’s AI or die, EE World reported on how the data generated by AI…
IMS 2024 roundup: RF components
Washington, DC — The International Microwave Symposium (IMS), which took place here in June 2024, featured a wide array of RF, microwave, and mmWave components. These components range from passive connectors and waveguides to amplifiers, switches, filters, and data converters. In general, these components make their way into military communications systems or commercial wireless networks.…
APEC 2025 organizing committee calls for Plenary Session proposals
The organizing committee of APEC 2025, to be held in Atlanta, Georgia, from March 16- 20, 2025, is welcoming suggestions for plenary session topics and speakers. The Plenary Session, held on Monday afternoon, prior to the start of the Conference’s exhibit hall opening, will present a series of cutting-edge, high-level talks from industry notables. These […]
Global governments detail semiconductor co-investment programs at IEEE ECTC 2024
Governments around the world are increasingly engaging in co-investment programs with the microelectronics packaging and semiconductor industries to develop and expand infrastructure within their jurisdictions. At the 2024 IEEE Electronic Components and Technology Conference (ECTC), representatives from Canada, the European Union, India, Korea, and the United States presented the diverse goals, frameworks, challenges, and achievements […]
OFC 2024: Network equipment
The infrastructure of data communications networks needs lots of fiber, semiconductors, and network equipment to bring data to the masses. Optical data networks form the backbone of today’s communications. Data centers, which seem to dominate any discussion of digital communications, depend heavily on fiber-optic connections from a few meters to many kilometers. Getting those bits…
Upcoming EE Training Day: optimizing thermal performance and system design of AI datacenter servers
This webinar will be held on May 16th, 2024, at 2 pm ET. As the demand for AI/ML tasks increases, effective thermal control within data centers becomes essential. This webinar will explore advanced thermal regulation techniques crucial for maintaining optimal performance amidst rising thermal pressures. It will also examine inventive cooling methods crafted to uphold […]
EE Training Day: automotive intelligent power distribution
This webinar explores a block diagram of a power distribution application and smart power devices. Its goal is to help with understanding the changes in vehicle power distribution architectures, including the trends and mega-trends driving the continuation of electrification’s evolution. While this webinar has already occurred, we understand that schedules can be demanding. That’s why we’ve […]
EE Training Day: advanced BLDC motor control solutions for modern designs
Applications requiring motors are finally in a position where they no longer have to sacrifice performance to meet their price targets. Today’s BLDC motor and control solutions are bringing excellent torque, speed, and efficiency to the table. This webinar discusses trends to improve motor efficiency, power density, low-speed torque, and reliability; the transition away from […]
