CUI’s Power Group today announced the addition of four new series to its family of non-isolated dc switching regulators. The next generation VX78‑500, VXO78‑500, VX78‑1000, and VXO78‑1000 series are extremely efficient, typically up to 96%, and balance maximizing economy while delivering a high level of performance as a direct alternative to using linear regulators. Utilizing […]
CUI’s Power Group today introduced a new line of low power, encapsulated ac-dc power supplies to their broad power portfolio ranging from 1 W to 12 kW. Housed in a compact, encapsulated board mount package with industry standard pin-outs, the new PSK series offers models with 6, 10, 15, and 20 W of continuous power. […]
CUI’s Thermal Management Group today announced an expansion to its existing portfolio of Peltier devices and dc fans with the addition of a heat sink product line. The new line of aluminum heat sinks, available in both extruded and stamped versions, are compatible with TO 218, TO 220, TO 252, and TO 263 transistor packages. […]
The post Aluminum heat sinks compatible with TO 218, TO 220, TO 252, and TO 263 transistor packages appeared first on Power Electronic Tips.
CUI’s Power Group today announced the addition of a compact 300 W series to its line of internal ac-dc medical power supplies. The VMS‑300A series, available in industry standard 3” x 5” open frame and metal enclosed packages, delivers efficiencies up to 94% and high power densities up to 14.5 W/in3. Meeting EN 60601-1 edition […]
CUI’s Power Group today announced the addition of four low power, open frame ac-dc power supply series to its VOF product family. The VOF‑6B, VOF‑10B, VOF‑15B, and VOF‑20B series are 6, 10, 15, and 20 W power additions to CUI’s general purpose ac-dc power supply portfolio now ranging from 6 W to 300 W. Housed […]
CUI’s Thermal Management Group today announced a new line of high-performance Peltier modules that boasts superior performance and reliability, thanks to its innovative arcTEC™ structure. This unique construction utilizes a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high-temperature solder, and larger P/N elements made from […]