Infineon Technologies AG introduces the new package technology TRENCHSTOP Advanced Isolation. It is available for TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs for best-in-class thermal performance and simpler manufacturing. The two versions are performance optimized to replace both fully insulated packages (FullPAKs) as well as standard and high-performance isolation foils. The new package targets applications like […]
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