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toshibaamericaelectronicscomponents

ESD protection diodes target mobile device interfaces

September 14, 2017 By Aimee Kalnoskas Leave a Comment

Toshiba America Electronic Components, Inc. (TAEC) has introduced a new bidirectional electrostatic discharge (ESD) protection diode for semiconductor devices used in mobile device interfaces. The DF2B7ASL utilizes snapback characteristics, providing low dynamic resistance and superior protective performance to safeguard against static electricity and noise. Housed in an ultra-compact package (0.32×0.62mm), the DF2B7ASL is designed for applications […]

Filed Under: Applications, Consumer, Industrial, Microcontroller Tips Tagged With: taec, toshibaamericaelectronicscomponents

Photorelays handle up to 3-A drive currents

August 4, 2017 By Maddie Lippert Leave a Comment

Toshiba America Electronic Components, Inc. (TAEC)* has added two mid-voltage products, the 100V TLP3823 with a 3A drive current, and the 200V TLP3825 with a 1.5A drive current, to its lineup of large current photorelays. The new products can be used to replace mechanical relays in applications including industrial equipment, general purpose inverters, HVAC, thermostats, […]

Filed Under: Applications, Industrial Tagged With: taec, toshibaamericaelectronicscomponents

Low-capacitance ESD diodes target high-speed interfaces in mobile devices

July 13, 2017 By Aimee Kalnoskas Leave a Comment

  Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has introduced a new lineup of multi-bit, low-capacitance electrostatic discharge (ESD) protection diodes for high-speed interfaces. Suitable for use in mobile devices, including smart phones, tablets, and wearable devices, the new diodes deliver excellent protection performance and support interfaces including USB 3.0/3.1 and HDMI. The new […]

Filed Under: Applications, Consumer, IoT, Power Electronic Tips, Wearables Tagged With: toshibaamericaelectronicscomponents

3D flash memory uses through-silicon via technology

July 11, 2017 By Aimee Kalnoskas Leave a Comment

Toshiba announced development of the world’s first[ BiCS FLASH three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased at […]

Filed Under: Microcontroller Tips Tagged With: toshibaamericaelectronicscomponents

High-temperature photocouplers target EV, HEV power module use

June 6, 2017 By Aimee Kalnoskas Leave a Comment

Toshiba America Electronic Components, Inc. (TAEC) has introduced a new range of 10 AEC Q101-qualified photocouplers designed to address the demanding isolation, interface, switching, and form factor requirements of automotive applications. Toshiba’s new range of photocouplers features a wide variety of devices – including the IC output TLX9304, TLX9378 and TLX9376 –  which are housed […]

Filed Under: Applications, Automotive/Transportation, Power Electronic Tips Tagged With: taec, toshibaamericaelectronicscomponents

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