Toshiba America Electronic Components, Inc. (TAEC) has introduced a new bidirectional electrostatic discharge (ESD) protection diode for semiconductor devices used in mobile device interfaces. The DF2B7ASL utilizes snapback characteristics, providing low dynamic resistance and superior protective performance to safeguard against static electricity and noise. Housed in an ultra-compact package (0.32×0.62mm), the DF2B7ASL is designed for applications […]
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Photorelays handle up to 3-A drive currents
Toshiba America Electronic Components, Inc. (TAEC)* has added two mid-voltage products, the 100V TLP3823 with a 3A drive current, and the 200V TLP3825 with a 1.5A drive current, to its lineup of large current photorelays. The new products can be used to replace mechanical relays in applications including industrial equipment, general purpose inverters, HVAC, thermostats, […]
Low-capacitance ESD diodes target high-speed interfaces in mobile devices
Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has introduced a new lineup of multi-bit, low-capacitance electrostatic discharge (ESD) protection diodes for high-speed interfaces. Suitable for use in mobile devices, including smart phones, tablets, and wearable devices, the new diodes deliver excellent protection performance and support interfaces including USB 3.0/3.1 and HDMI. The new […]
3D flash memory uses through-silicon via technology
Toshiba announced development of the world’s first[ BiCS FLASH three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased at […]
High-temperature photocouplers target EV, HEV power module use
Toshiba America Electronic Components, Inc. (TAEC) has introduced a new range of 10 AEC Q101-qualified photocouplers designed to address the demanding isolation, interface, switching, and form factor requirements of automotive applications. Toshiba’s new range of photocouplers features a wide variety of devices – including the IC output TLX9304, TLX9378 and TLX9376 – which are housed […]
