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Pat Curran

zSFP+ stacked belly-to-belly connectors enable higher faceplate density

December 3, 2019 By Pat Curran

TE Connectivity has introduced its new zSFP+ stacked belly-to-belly connectors that are designed to support data rates at both 28G NRZ and 56 Gbps PAM-4. The upright latching feature for zSFP+ stacked belly-to-belly connectors is a key capability that can accommodate four row belly-to-belly applications to enable higher faceplate density and maximize printed circuit board […]

Filed Under: Connector Tips Tagged With: teconnectivity

Master Electronics & Anderson Power Products Sign Distribution Agreement

May 17, 2016 By Pat Curran Leave a Comment

Santa Monica, CA – Master Electronics, a leading global distributor of electromechanical, interconnect and passive components, today announced a distribution partnership with Anderson Power Products. Since 1877, Anderson Power Products has been a leader in developing high quality, low cost, power interconnect solutions. APP is often found in high power and/or high voltage applications. “Anderson […]

Filed Under: Industry News

Multiple charging modes from a single amplifier

February 26, 2016 By Pat Curran

by Michael A. de Rooij, VP, Applications Engineering, Efficient Power Conversion Though there are two standards for charging appliances wirelessly, a single circuit can be devised to serve…

Power Electronic Tips

Filed Under: Applications, Power Electronic Tips, Wireless Tagged With: EPC

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