Analog Devices, Inc. is now offering the LTM4645, a 25A step-down regulator with the ability to current share multiple independent devices (N) where at least one LTM4645 is used as backup (+1) to ensure power availability if one device in this N+1 arrangement detects a fault and must be disconnected. For example, a 75A, 1V load […]
Data centers
SiC 650-V Schottky diodes sport 1.25-V VF, 17% better figure of merit
Infineon Technologies AG introduces the CoolSiC Schottky diode 650 V G6. This latest development in the CoolSiC diode family is built upon the distinctive characteristics of the G5, providing reliability, quality, and increased efficiency. The CoolSiC G6 diodes are a perfect complement to the 600 V and 650 V CoolMOS™ 7 families. They are aiming […]
DC-DC power IC converts 48 V to extremely low voltage
The HS200 is a dc-dc power IC that offers greater than 97% efficiency at 2.6 W and greater than 90% efficiency at 15 W. With no load, the HS200 consumes only 0.5 mW. Power can be pulled from any of its three outputs simultaneously up to 15 W. Efficiency is nearly flat from full load […]
Cache coherent interconnect for accelerators test chip will use 7-nm FinFET process technology
Xilinx, Arm, Cadence Design Systems, Inc., and TSMC announced a collaboration to build the first Cache Coherent Interconnect for Accelerators (CCIX) test chip in TSMC 7nm FinFET process technology for delivery in 2018. The test chip aims to provide a silicon proof point to demonstrate the capabilities of CCIX in enabling multi-core high-performance Arm® CPUs […]
Mini-coupler patch panels save space in data center, LAN, MDF/IDF, gigabit ethernet connectivity apps
L-com Global Connectivity launched a new series of mini-coupler feed-thru patch panels for use with data center, LAN, MDF/IDF, and Gigabit Ethernet connectivity applications. The mini-couplers used in these panels provide the same performance and quality as full-size Ethernet couplers, but measure less than one inch in length. This design provides more room for installers to work […]
Modular current multipliers for high-performance processors
Vicor Corporation announced the introduction of Power-on-Package modular current multipliers for high performance, high current, CPU/GPU/ASIC (“XPU”) processors. By freeing up XPU socket pins and eliminating losses associated with delivery of current from the motherboard to the XPU, Vicor’s Power-on-Package solution enables higher current delivery for maximum XPU performance. In response to the ever-increasing demands […]
Motherboards, servers use Atom C3000 SoCs
Super Micro Computer, Inc. introduced a full suite of all-in-one solutions optimized for the growing Embedded Appliance, Intelligent Datacenter and Network Edge markets. Supermicro’s compact systems and motherboards optimized with the new Intel Atom C3000 (Denverton) SoC feature lower thermal and power requirements and can improve performance by 2.5X compared to the previous generation. Supermicro’s […]
Higher capacity, better performance for PCIe NVMe SSDs
Smart IOPS, Inc. announced today that it is expanding its portfolio of high-performance Data Engine PCI Express (PCIe) NVM Express (NVMe) enterprise solid state drives (SSDs). In all, the company is set to offer three new and distinctive categories of data center and High–Performance Computing (HPC) SSD products targeting multiple market segments: Data Engine T2HP […]