• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Battery Power
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • 5G
    • Automotive/Transportation
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Handbooks
    • EE Training Days
    • Tutorials
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • White Papers
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • DesignFast
  • Videos
    • EE Videos and Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Bill’s Blogs
  • Advertise
  • Subscribe

How does sensor fusion improve an alarm system?

September 11, 2019 By Randy Frank Leave a Comment

At Sensors Expo 2019, Tanja Hofner, a Principal Hardware Engineer for RF and Sensors in Infineon’s Power Management and Multimarket segment explains the operation of the company’s Integrated Alarm System demo. The demo uses two Infineon sensors: the digital XENSIV IM69D130 microelectromechanical systems (MEMS) microphone and a DPS310 digital barometric pressure sensor as well as time-synchronized sensor fusion to provide improved response to common error-causing stimuli.

The system listens for glass breaking sounds and once the glass has been broken, the pressure change between the inside and the outside of the house is detected by the pressure sensor. Sensor fusion combines the data from the two sensors to minimize false alarms. With the pressure sensor in the system, both forced and unforced intrusion without breaking glass can be detected.

The IM69D130 microphone has a 105 dB dynamic range and a 69 dB(A) signal-to-noise ratio. The DPS310 pressure sensor has an operating range of 300 hPa to 1200 hPa, precision of 0.005hPa and relative accuracy of ±0.06hPa.

For potential users to evaluate the alarm system, Infineon has an alarm system testing kit, a form factor reference design and a chip-down design. The testing kit includes:

  • Easy change of modes via app
    • Demo mode
    • Glass break mode
    • Intruder mode
  • Recording of audio files and pressure data
  • Audio output of detected (glass break) events

The form factor reference design with fully qualified software includes:

  • Easy visualization of all three modes via UART
    • Test mode
    • Glass break mode
    • Intruder mode
  • Adjustable sensitivity for different room sizes
  • LED indication of detected glass break/intrusion event
  • Fully tested and qualified software on a small form factor

You Might Also Like

Filed Under: Featured, Sensor Tips Tagged With: infineon

Reader Interactions

Leave a Reply Cancel reply

You must be logged in to post a comment.

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Primary Sidebar

EE Engineering Training Days

engineering

Featured Contributions

Five challenges for developing next-generation ADAS and autonomous vehicles

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

GaN reliability milestones break through the silicon ceiling

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

More Featured Contributions

EE Tech Toolbox

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE Learning Center

EE Learning Center
“ee
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills

R&D World Podcasts

R&D 100 Episode 10
See More >

Sponsored Content

Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

Connectors Enabling the Evolution of AR/VR/MR Devices

Award-Winning Thermal Management for 5G Designs

Making Rugged and Reliable Connections

Omron’s systematic approach to a better PCB connector

Looking for an Excellent Resource on RF & Microwave Power Measurements? Read This eBook

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • problem connecting to my xilinx device VIA global IP
  • ISL8117 buck converter blowing up
  • need of carrier supression when locking to cavity resonator
  • Wireless microphone reviews
  • audio transformers impedance

RSS Current Electro-Tech-Online.com Discussions

  • RS485 bus: common ground wire needed or not?
  • Kawai KDP 80 Electronic Piano Dead
  • Good Eats
  • What part is this marked .AC ?
  • Photo interrupter Connections
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Teardown Videos
  • Advertise with us
  • Contact us
  • About Us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy