TE Connectivity (TE) announced its new Sliver card edge connectors have been adopted as the standard connector design into the SNIA (Storage Networking Industry Association) Small Form Factor Technology Work Group’s SFF-TA-1002 specification and are the highest-performing card edge connectors in the standard. TE’s industry-leading SFF-TA-1002 compliant connectors are protocol-agnostic, multi-lane connectors that are useful […]
TE
Stainless-steel D-sub connectors meet demand for nontoxic applications
TE Connectivity, Harrisburg, Pa., recently released its new line of rugged Amplimite D-subminiature (D-sub) connectors that put the same corrosion resistance of connectors made with cadmium into an environmentally-friendly, stainless-steel housing. The new stainless-steel housing is designed to meet the performance requirements of MIL-DTL-24308, offering up to 500 hours of resistance to salt spray in […]
TE Connectivity to show high-speed connector innovations at DesignCon
TE Connectivity (TE) will showcase a broad range of industry-leading high-speed data communications connectivity solutions in booth 817 at the DesignCon 2019 expo Jan. 30-31 in Santa Clara, Calif. TE offers a full spectrum of powerful, ultra-compact solutions for optimizing the latest data center innovations, delivering the speed, scalability, space-savings, improved thermals, power and reach […]
OSFP connectors and cable assemblies from TE Connectivity offer 400 Gbps
TE Connectivity has introduced its new Octal Small Form Factor Pluggable (OSFP) connector and cable assembly portfolio, which supports next-generation data center needs with data rates of 200 and 400 Gbps. These products are designed to support 8x28G NRZ and 8x56G PAM-4 protocols, with a roadmap to 8x112G PAM-4 for future system upgrades. TE’s OSFP […]
124 position connectors and cable assemblies enable up to x20 signal transmission lanes, 40 differential pairs
TE Connectivity has introduced its new 124 position Sliver internal I/O connectors and cable assemblies, which provide a high-density solution that enables up to x20 signal transmission lanes, or 40 differential pairs. The 124 position Sliver connectors currently support PCIe Gen 4 and Gen 5, Ethernet 56G and SAS-5. The cable assemblies currently support PCIe […]
Side exit power cable assemblies deliver 50 percent space savings
TE Connectivity has introduced its new side exit CROWN CLIP Junior power cable assemblies, which can deliver 50% space savings and significantly improve design flexibility over traditional bus bar cable assemblies. By using a side exit for the power cables, this solution minimizes the need to bend cables when routing them beyond the center of […]
TE Connectivity reduces high-density switch design costs with zQSFP+ stacked belly-to-belly cage
TE Connectivity (TE) has launched its zQSFP+ stacked belly-to-belly cages, which support a single printed circuit board (PCB) architecture (versus two PCBs) in each line card, saving customers significant costs. Designed for high-density switches with 48 or 64 silicon port designs, TE’s new zQSFP+ stacked belly-to-belly cages address the requirements for higher density switch designs, […]
TE Connectivity releases over 25,000 new digital models in collaboration with SnapEDA
TE Connectivity and SnapEDA, the Internet’s first parts library for circuit board design, are collaborating to make more than 25,000 new digital models available to electronics designers, helping them bring their products to market faster. Traditionally, designers have spent days creating models for each component in their designs, a tedious and time-consuming process. Some components, […]
TE Connectivity highlights 400Gbe OSFP and QSFP-DD connectivity at DesignCon 2018
TE Connectivity (TE) today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE is demonstrating the new products in booth 817 at the DesignCon 2018 expo through tomorrow, February 1 in Santa Clara, Calif. Targeted for […]
TE Connectivty and Credo demonstrate 112G single-lane connectivity at DesignCon 2018
TE Connectivity (TE) and Credo, provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high-performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies. The companies will hold demonstrations of 112Gbps over a chip-to-module (IO) channel and over a backplane channel at DesignCon 2018. […]