NXP Semiconductors N.V. introduced the LPC84x family, the latest addition to its rapidly expanding LPC800 series of 32-bit ARM 30 MHz Cortex-M0+ based microcontrollers. The family, designed to balance power, performance and price, addresses the growing demand to simplify and speed development — enabling smarter next-generation designs to be cost- and power-efficient. “We’re extremely excited […]
Microcontroller Tips
Micro:Bit Coding Device now Available From US Distributor
Premier Farnell, the Development Distributor, has made the BBC Micro:bit available to buy in North America through Newark element14 and MCM Electronics. The micro:bit was originally launched in the UK in March 2016 following an educational programme led by the BBC, in partnership with a group of technology partners including ARM, Microsoft and Premier Farnell. […]
WiFi SiP handles dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready”
Silex Technology America, Inc., a global leader in wired and wireless networking solutions, today introduced its newest embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers cost effective, small form factor, and low power Wi-Fi+BT connectivity […]
Chip design IP now works with 7-nm Leading-Performance (7LP) FinFET process
Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology. Synopsys and GF collaboration on the new process addressed several new challenges specific to the 7LP process. This process is expected to deliver 40 percent more processing power and twice the area scaling […]
Platform boosts I/O performance with Intel Omni-Path fabric for dense HPC
Super Micro Computer, Inc., a global leader in compute, storage and networking technologies including green computing, delivers the Intel® Omni-Path Architecture (Intel® OPA) in the new generation, high-performance, X11 8U/4U SuperBlade® systems supporting the upcoming Intel® Xeon® Processor Scalable Family (codenamed Skylake). The X11 SuperBlade® is a density and performance optimized solution for high performance and Artificial Intelligence applications. The SuperBlade […]
GPU Accelerator Supports AI Applications
Inspur unveiled GX4, a new flexible and high scalability AI accelerating box at ISC 2017. The GX4 is able to achieve the decoupling coprocessor resources including CPU and GPU, Xeon Phi and FPGA, expand the computing power on demand, and provide highly flexible support to various AI applications in GPU-accelerated computing. This is another innovative effort […]
Tips book for makers includes Raspberry Pi, BeagleBoard ideas
Premier Farnell, The Development Distributor, has launched a new ‘Tips Book for Makers’, following the success of its ‘Essential Design Tips for Engineers’ series. The element14 community provides support and inspiration through a combination of articles, design challenges, roadtests and the power of close to half a million global members with their combined experienced and […]
Low-power 32-bit microcontrollers reduce run currrents by half
The latest PIC32 microcontroller family from Microchip Technology Inc. expands Microchip’s eXtreme Low Power (XLP) technology to 32-bit products. The PIC32MX1/2 XLP offers current PIC32MX customers an easy migration path to achieve higher performance at much lower power, enabling both increased functions and longer battery life in portable applications. The PIC32MX1/2 XLP family increases performance in […]
ARM design environment aids development of mixed-signal IoT designs
Cadence Design Systems, Inc. today announced expanded support for the enhanced ARM® DesignStart™ program, including the newly added ARM Cortex®-M3 processor and the ARM CoreLink™ SDK-100 System Design Kit, which includes the fully verified CoreLink SSE-050 subsystem, enabling engineers to further accelerate the delivery of mixed-signal internet of things (IoT) designs. The Cadence® Hosted Design Solutions (HDS) design environment […]
World’s smallest common-mode choke targets automotive Ethernet apps
TDK Corporation presents the ACT1210L common-mode choke – the world’s smallest of its type for automotive Ethernet applications. Its dimensions are just 3.2 mm x 2.5 mm x 2.5 mm, making it just half the size of the existing ACT45L choke which measures in at 4.5 mm x 3.2 mm x 2.8 mm. Series production […]