As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth. Microchip Technology Inc. announced an expanded data center portfolio and its entrance into the memory infrastructure […]
FPGAs handle IP for low-power, small form factor machine vision designs
As compute-intensive, vision-based systems are increasingly integrated at the network edge, Field Programmable Gate Arrays (FPGAs) are quickly becoming a preferred flexible platform for next-generation designs. In addition to requiring high bandwidth processing capabilities, these intelligent systems are deployed in small form factors with tight thermal and power constraints. To help developers accelerate designs, Microchip […]
Touchscreen controllers boost SNR in 9-20-in. touchscreens
To address electromagnetic interference (EMI) and electromagnetic compatibility (EMC) challenges faced by developers of automotive touchscreens, three new maXTouch touchscreen controllers and optimization services are now available from Microchip Technology Inc. The TD family of touch controllers features a new differential mutual signal acquisition method that significantly increases the Signal-to-Noise Ratio (SNR). This allows the use […]
Dev board speeds development of SpaceVPX-compliant data networking systems
Microchip Technology Inc. via its Microsemi subsidiary, collaborated with STAR-Dundee to create an evaluation platform that implements SpaceFibre technology, which was recently recognized by the VITA Standards Organization (VSO) as a control-and-data plane option for its SpaceVPX interconnect standard. The SpaceFibre standard is already published as a very high-speed serial link standard by the European Cooperation […]
eSPI to LPC bridge enables integration of standard in legacy industrial equipment
As the industrial computing industry transitions from Low Pin Count (LPC) to enhanced Serial Peripheral Interface (eSPI) bus technology, developers face high development costs to update existing equipment to the new standard. To allow developers to implement the eSPI standard while preserving large investments in legacy LPC equipment, Microchip Technology Inc.announced the industry’s first commercially […]
Eight-port PoE switch provides 60 W per port
The adoption of commercial smart lighting systems has grown significantly as organizations strive to improve energy efficiency and operational costs in buildings. Power over Ethernet (PoE) is rising in popularity for these systems, providing a reliable and easy-to-install solution that manages power and data over a single Ethernet cable. To support larger and more efficient […]
Specialized diodes, Part 2: Varactor, Gunn, and PIN diodes
Part 1 of this FAQ reviewed the standard PN semiconductor diode, and looked at some specialized variations called the tunnel, Zener/avalanche, and Schottky diodes. Part 2 briefly explores the varactor, Gunn, and PIN diodes. Q: What about the varactor diode? A: The varactor diode (Figure 1), also called a voltage variable capacitor (VVC) or varicap […]
Latest release of synchronization device addresses timing adds 10 Gb Ethernet support
One of the biggest 5G network deployment challenges is synchronizing higher volumes of more densely packed base stations. Another is keeping services operating through Global Navigation Satellite System (GNSS) lapses due to vulnerabilities such as jamming, spoofing or loss of signal. Microchip Technology Inc., via its Microsemi subsidiary, is solving these and other challenges for […]
Specialized diodes, Part 1: Tunnel, Zener/Avalanche, and Schottky diodes
There are diode varieties which do much more than just block current flow in one direction and allow it in the other; some of these special diodes have favorable attributes while others are essential in modern electronics. Every electronic engineer is familiar with the diode: it’s a basic, widely used, two-terminal semiconductor device. The diode’s […]
Power SiC components include 600-V MOSFETs, 600/1,200-V Schottky barrier diodes
Demand is growing for SiC power products that improve system efficiency, robustness and power density in automotive, industrial and aerospace and defense applications. Microchip Technology Inc., via its Microsemi subsidiary, today announced the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range […]
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