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Taiwan Semiconductor

TVS device handles 300 V peak transients in DO-218AB Package

February 22, 2025 By rtraiger

Taiwan Semiconductor introduces its new SUPER CLAMP Snapback TVS device series. These TVS diodes feature snapback characteristics with a 1.0 to 1.05 clamping ratio between the designated breakdown voltage and clamping voltage. The lower clamping voltage of the optimized snapback TVS protects the circuit at a higher peak pulse current than conventional TVS diodes, allowing designers to use […]

Filed Under: APEC 2025, Automotive/Transportation, Power Electronic Tips Tagged With: Taiwan Semiconductor

Rectifiers offer robust ESD protection for automotive applications

February 28, 2024 By rtraiger

Taiwan Semiconductor announces its new line of automotive-qualified rectifiers featuring ESD withstand capability. The new TSD Series rectifiers simultaneously provide repetitive peak reverse voltage (VRRM) of up to 600V as well as ESD protection of >10,000V (per IEC-61000-4-2). Devices in the series have optional current ratings of 1A, 2A, and 3A, and operating temperature ranges from […]

Filed Under: Applications, Automotive/Transportation, Power Electronic Tips Tagged With: Taiwan Semiconductor

Tiny ESD devices target wearables market

November 1, 2023 By Redding Traiger

Taiwan Semiconductor announces its new TESD Series of single-channel ESD clamping diodes offering size and performance specifications optimized for wearable applications. The new TESD devices’ unique design features proprietary bidirectional clamping cells (for ESD protection up to ±30kV) in an ultra-small DFN0603 package.   The devices in the new TESD Series are offered in versions with 5.0V […]

Filed Under: Applications, Power Electronic Tips, Wearables Tagged With: Taiwan Semiconductor

Schottkys in DPACK footprint offer drop-in improvements in power density, thermal performance.

September 27, 2023 By Redding Traiger

Taiwan Semiconductor announces its new ThinDPAK family of ultra-fast-recovery Schottky rectifiers. ThinDPAK devices have the same footprint as standard DPAKs – but come in a thinner (1.33mm) package and offer superior power density and thermal performance. Fully AEC-Q qualified with a maximum operating temperature (Tj, max) of  175°C and typical reverse-recovery time of 25ns, ThinDPAKs assure […]

Filed Under: Power Electronic Tips Tagged With: Taiwan Semiconductor

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