The abilities of robots continue to advance with highly capable products performing a variety of tasks, looking almost humanlike as they speak, and even garnering appearances in movies. Perhaps less attractive but equally or even more useful, creeping or crawling robots bring drones down to earth and, in fact, inside the earth. Unlike the micro […]
FAQ
Open RAN: Interoperability is not plug-and-play
EE World spoke with Adam Smith of LitePoint about the progress and challenges of Open RAN interoperability and testing.
How does artificial intelligence relate to immersive audio?
Tools like neural networks (NNs), machine learning (ML), and artificial intelligence (AI) are being applied to hard problems related to immersive audio. This FAQ will examine how NNs and ML are being used to up-mix audio tracks into their original constituent parts, how NNs are being used to produce personalized head-related transfer functions (HRTFs) and […]
FAQ on magnetos for power and ignition, Part 2
This simple, mechanically driven power source is nearly 200 years old and still has a well-defined, albeit limited, role in today’s systems. Most of the historical and present-day applications for magnetos are for spark-plug ignition systems. This part looks at that aspect in more detail. Q: What’s the structure and operation of a basic magneto-based […]
What’s the difference between sensors used in underwater, flying, and creeping robots or drones? Pt 2
While flying drones are common in military, consumer, and even commercial applications, there are a few intriguing, much smaller and less familiar flying drones in development. Called a micro air vehicle (MAV), or micro aerial vehicle, this class of very small flying drones have applications in agriculture, disaster relief, by both military and enterprise users, […]
Why 3D packaging could be the next breakthrough for processing
As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To help you learn more […]
FAQ on magnetos for power and ignition, Part 1
This simple, mechanically driven power source is nearly 200 years old and still has a well-defined, albeit limited, role in today’s systems. What or who is a magneto? No, a “magneto” is not only the powerful mutant who has the ability to generate and control magnetic fields and first appeared in the debut issue of […]
How do I choose an electric motor, and how do I test it? Part 4
You indeed can measure three-phase power in a motor with just two wattmeters. Part 3 of this FAQ concluded with a simplified diagram showing a test setup that included a programmable power supply, a motor under test, a mechanical load, a power analyzer, and host computer. The programmable power supply could simulate the AC line […]
What’s the difference between sensors used in underwater, flying, and creeping robots or drones? Pt 1.
Obviously, different design requirements exist depending on the targeted applications but autonomous or remotely piloted drones also dictate different criteria. One of the more unique underwater applications involved undersea (in the ice) measurements in Antarctica. The intent of the expedition was to gather sufficient, highly accurate information to improve modeling of ice shelf melting and […]
Why advanced packaging is vital to the future of semiconductors
The cost and the physics of fitting more transistors in the space available are showing diminishing returns. The concept of “known good die” is much more difficult to quantify. For all the talk in the semiconductor industry about trying to reach 1.8 nm process nodes, advanced packaging and its impact on performance seems to be […]