EPC announces the availability of the EPC9146, a 400 W motor drive demonstration. The EPC9146 power board contains three independently controlled half-bridge circuits, featuring the EPC2152 monolithic ePower Stage with integrated gate driver, 80 V maximum device voltage, 15 A (10 ARMS) maximum output current. The inverter board measures just 81 mm x 75 mm […]
Hybrid flyback controller optimized for USB chargers/adapters
Rapid technology and market developments in the fast charger and adapter market continuously challenge designers of power supply systems. To meet the increasing demand for higher power density and energy efficiency, Infineon Technologies AG expands its XDP family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology. Available in a […]
Automotive power modules based on SiC MOSFETs
Infineon Technologies AG introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with 1200 V blocking voltage optimized for traction inverters in electric vehicles (EV). The power module is based on the automotive CoolSiC trench MOSFET […]
Cybersecurity network extension now supports resource-constrained Ethernet devices
ODVA announces that CIP SecurityTM, the cybersecurity network extension for EtherNet/IPTM, has added support for resource-constrained EtherNet/IP devices. CIP Security can now provide device authentication, a broad trust domain, device identity via Pre-Shared Keys (PSKs), device integrity, and data confidentiality for resource-constrained devices such as contactors and push-buttons. Additionally, a narrow trust domain, user authentication, […]
Compact gate drivers integrate a two-level slew rate control
The highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG introduces its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor. The gate driver family comes in an 8 mm wide-body package to ensure easy design-in and integrates a two-level slew rate control, which significantly […]
Power rectifier handle 8-A current, feature 35 nsec reverse recovery time
SSDI has released the new SDR8400 series of high-density rectifiers. With similar dimensions as the 1N6627, the SDR8400 delivers 8 amps, which is more than three times the output current of the 1N6627. The SDR8300 – SDR8400 series also features a voltage range of 300 – 400 volts, low forward voltage drop of 1.02 V, high […]
SiC 1.2-kV MOSFET power modules target high-power-density apps
Infineon Technologies AG has upgraded the EasyDUAL CoolSiC MOSFET modules with a new aluminum nitride (AIN) ceramic. The devices come in a half-bridge configuration with an on-state resistance (RDS(on)) of 11 mΩ in an EasyDUAL 1B package and 6 mΩ in an EasyDUAL 2B package. With high-performance ceramic, the 1200 V devices are suitable for […]
New 600V IGBT modules target inverter applications
ROHM Semiconductor announced that it has developed four new 600V IGBT Intelligent Power Modules (IPMs) as part of its BM6437x series that deliver best-in-class low noise characteristics, together with low loss, making them ideal for power conversion in inverters. The devices are used in compact industrial equipment, such as small capacity motors for robots, as […]
3U OpenVPX GPGPU module designed for compute-intensive ISR and EW systems
Curtiss-Wright’s Defense Solutions division introduced its first 3U OpenVPX GPGPU processor module designed in compliance with the U.S. Army CCDC C5ISR Center’s C4ISR/EW Modular Open Suite of Standards (CMOSS) and aligned with standards currently being defined by The Open Group Sensor Open Systems Architecture (SOSA) Consortium. Developed to support compute-intensive ISR and EW systems, this fully rugged […]
Tiny high-power TVS diodes excel at ESD protection
TDK Corporation has released tiny high-power TVS diodes for ESD protection, extending its portfolio of components for bidirectional overvoltage protection of I/O interfaces. The space requirement of the so-called chip-scale package (CSP) is just 400 x 200 µm² (CSP01005) or 600 x 300 µm² (CSP0201), while the package height of just 100 µm is also […]