In power electronics, motor drives take up a major share in the market. With its CoolSiC MOSFET Modular Application Design Kit (MADK) boards Infineon Technologies AG helps in further shortening time to market in this relevant segment. As part of the MADK platform for motors of up to 7.5 kW, the evaluation board EVAL-M5-IMZ120R-SIC is […]
Digital power flyback controller optimized for LED lighting designs
Infineon Technologies AG introduces the XDP digital power XDPL8219. The high-performance flyback controller features secondary-side regulation for high-performance and robust LED designs. It provides high power factor and constant voltage output. The device operates in quasi-resonant mode (QRM) to maximize the efficiency and minimize the electromagnetic interference (EMI) over a wide load range. It accommodates […]
IGBT power modules optimized for EV traction inverters
Infineon Technologies AG introduces a new IGBT power module tailored to the needs of electric vehicle traction inverters in the 80 kW to 100 kW power class: the HybridPACK DC6i. This six-pack module is optimized to deliver an excellent fit of system cost and performance to hybrid and small battery electric vehicles. It combines Infineon’s established EDT2 IGBTs with […]
Half-bridge MOSFET driver ICs target motor-control automotive apps
From power lift gate and sunroof to electric seat adjustment and fuel pumps, an increasingly large number of electric motors ensure safety and comfort in modern cars. Infineon Technologies AG is now presenting a new product family called Motor System ICs designed for control of both brushed and brushless DC motors. These ICs are the world’s […]
SiC MOSFET modules target EV charging, solar inverter apps
Infineon Technologies AG adds another industry-standard package to its CoolSiC MOSFET 1200 V module family. The proven 62 mm device has been designed in half-bridge topology and is based on the trench chip technology. It opens up silicon carbide for applications in the medium power range starting at 250 kW – where silicon reaches the […]
QPL-qualified rad-hard MOSFETs feature direct-to-PCB mounting
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers. Too often, different thermal coefficients lead to an expansion mismatch of different materials. IR HiRel, an Infineon Technologies AG solves this issue with fourteen newly QPL-qualified radiation-hardened (rad-hard) MOSFETs housed in an innovative direct-to-PCB mounting package. SupIR-SMD […]
Low-current LED driver ICs optimized for LED strips, architectural and appliance lighting
Infineon Technologies AG released the BCR431U, a constant current linear LED driver IC that provides low-voltage drop performance for regulating LED current. It is the second device released in the new generation BCR family with low voltage drop focusing on low current designs of up to 37 mA. Typical applications for the new BCR431U include […]
Eval platform wrings out drive options for 1,200-V MOSFETs
Double pulse testing is a standard procedure for designers to learn about the switching behavior of power devices. To facilitate the testing of drive options for the 1200 V CoolSiC MOSFET in TO247 3-pin and 4-pin packages, Infineon Technologies AG introduced a modular evaluation platform. Its center comprises a motherboard with interchangeable drive cards. The drive […]
New 40-60-V MOSFETs feature extremely low RDS(on), high-current capability
Infineon Technologies adds three new devices in the D²PAK 7pin+ package to its StrongIRFET 40-60 V MOSFET product family. These new components offer extremely low R DS(on) and high current-carrying capability, which increases both robustness and reliability for high-power-density applications that require high efficiency. The three new MOSFETs target battery-powered applications including, battery-powered tools, battery […]
High-efficiency IGBT modules provide 11 kW and 22 kW in compact packages
Infineon Technologies AG adds new current ratings to its 1200 V TRENCHSTOP IGBT7 modules. This completes the Easy 1B and 2B portfolio, which is now offering power solutions for up to 11 kW in PIM and up to 22 kW in six-pack topologies with the latest chip technology. Customers have the choice: either to increase […]
