Power switches based on the wide bandgap (WBG) material gallium nitride (GaN) enable excellent efficiency and high switching frequency, starting a new era in power electronics. To support this development, Infineon Technologies AG adds the new CoolGaN IPS family of integrated power stage (IPS) products to its broad portfolio of WBG power devices. The initial […]
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Hybrid flyback controller optimized for USB chargers/adapters
Rapid technology and market developments in the fast charger and adapter market continuously challenge designers of power supply systems. To meet the increasing demand for higher power density and energy efficiency, Infineon Technologies AG expands its XDP family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology. Available in a […]
Automotive power modules based on SiC MOSFETs
Infineon Technologies AG introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with 1200 V blocking voltage optimized for traction inverters in electric vehicles (EV). The power module is based on the automotive CoolSiC trench MOSFET […]
Compact gate drivers integrate a two-level slew rate control
The highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG introduces its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor. The gate driver family comes in an 8 mm wide-body package to ensure easy design-in and integrates a two-level slew rate control, which significantly […]
SiC 1.2-kV MOSFET power modules target high-power-density apps
Infineon Technologies AG has upgraded the EasyDUAL CoolSiC MOSFET modules with a new aluminum nitride (AIN) ceramic. The devices come in a half-bridge configuration with an on-state resistance (RDS(on)) of 11 mΩ in an EasyDUAL 1B package and 6 mΩ in an EasyDUAL 2B package. With high-performance ceramic, the 1200 V devices are suitable for […]
Hybrid power modules combine SiC MOSFETs and IGBT technology
Infineon Technologies AG has launched a new EasyPACK 2B module in the company’s 1200 V family. The module comes in 3-level Active NPC (ANPC) topology and integrates CoolSiC MOSFETs, TRENCHSTOP IGBT7 devices, and an NTC temperature sensor along with PressFIT contact technology pins. The power module is suitable for fast-switching applications like energy storage systems (ESS). […]
Gate drivers feature reinforced isolation for safety and long life
Infineon Technologies AG has expanded its easy-to-design EiceDRIVER X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families. Both families now offer variants with superior reinforced isolation for higher application safety and long operating life. The new family members are VDE 0884-11 certified. With 8 mm wide-body […]
Power-stage reference boards handle rotary refrigerator compressors
Infineon Technologies AG introduces two new reference boards designed for rotary refrigerator compressors. Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards. Since the design of the reference boards is system tested developers can drastically reduce their own system development time. The […]
High-voltage superjunction MOSFETs deliver 10 m Ω RDS(on)
In applications where MOSFETs are switched at low frequency, high-power product designs must meet several key characteristics: They have to minimize conduction losses, provide optimal thermal behavior, and enable more compact and lighter systems – all while maintaining the highest quality at a low cost. To meet these requirements, Infineon Technologies AG is enhancing the […]
Power diodes target industrial welding applications
Infineon Technologies Bipolar GmbH & Co. KG launches a new generation of power diodes. The new housing less diode family is designed for medium frequency resistance welding and high current rectifier applications. The devices meet the market requirements for higher forward current, low conduction losses, and higher power cycling capability. With this new design, the […]
