CUI Devices’ Thermal Management Group announced the continued expansion of its heat sinks product portfolio with the addition of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family supports a wide range of sizes from 8.5 mm x 8.5 mm up to 60 mm x 60 mm with profiles from 6 mm up to 25 […]
Power Electronic Tips
Thermistors, thermocouples, and RTDs for thermal management
Thermal management is the ability to control the thermal environment of an electronic system. It is often associated with cooling heat-generating electronics, but it also encompasses generating heat in cold environments to maintain optimal system operation or power wax-based linear motors. As a result of the many uses for thermal management, a wide variety of […]
Fuses, eFuses, thermistors, and fusible resistors – which and when?
Fuses, eFuses, various types of thermistors, and fusible resistors can be used to provide varying levels of circuit protection. Fuses provide only the most basic level of overcurrent and short-circuit protection. Thermistors can be added to provide inrush current control, and a fusible resistor can provide both inrush current control and overcurrent/short-circuit protection. The most […]
Diode protection switch works in Type-C power delivery
Alpha and Omega Semiconductor Limited announced a new Type-C Power Delivery high voltage sink protection switch using ideal diode methodology for reverse current protection. The AOZ13984DI-02 and AOZ13987DI-02 are smart protection switches in a single small thermally enhanced 3mm x 3mm DFN package. The new products use AOS¡¯s advanced co-packaging technology, combining a high-performance IC with protection features and our latest […]
Encapsulated 250-W dc/dc converters target extreme environments
ABSOPULSE Electronics PDC 250-HSA-P59 series is a recent addition to the company’s line of fully encapsulated, convection-cooled DC-DC converters. The 250W units are entirely potted with a thermally conductive MIL-grade silicon rubber compound with a UL94V-0 flammability rating. Full encapsulation provides immunity to shock, vibration, moisture, dust, salt, and other contaminants, as well as ensuring […]
What are TENGs and PENGs and what are they good for?
Small self-powered systems, including wireless sensors and small robots currently under development, can use triboelectric nanogenerators (TENGs) and piezoelectric nanogenerators (PENGs) as prime power sources. TENGs and PENGs offer large open circuit voltages, low materials cost, ease of fabrication, and good energy conversion efficiencies. TENGs use triboelectricity, commonly called static electricity, to convert common mechanical […]
Redrivers meet modern standby mode requirements
Diodes Incorporated has introduced the PI3EQX12902E/PI3EQX12904E to further strengthen its ReDriver product offering. These ReDrivers meet the Modern Standby mode requirements as outlined by Microsoft Corporation, and deliver elevated linearity and ultra-low jitter characteristics now expected in laptop, notebook, industrial PC, and embedded system designs. Operating from a 3.3V rail and in standby mode, the […]
Hyperfast rectifiers get QPL certification for aero/defense apps
DLA Land and Maritime approved SSDI’s JANS1N8257US hyperfast rectifiers for QPL certification per MIL-PRF-19500/477. SSDI developed these 6 amp, 200 volts, 30 ns devices to provide higher performance than the 1N5811 within the smaller 1N5806 footprint. The JANS1N8257US provides significant improvements in output current, reverse voltage, peak surge current (125 A), thermal resistance (8.5°C/W), high-temperature […]
100-W charge pump fast charging IC targets smartphones, mobile hardware
NuVolta Technologies announced its second-generation charge pump fast charging IC — NU2205, which is the first 100W charge pump fast charging IC in the whole industry. NU2205 is the leading fast charging IC for a 2S battery with a 4:2 charge pump fast-charging architecture for ultra-fast charging applications in flagship smartphones and other mobile devices. […]
EMI control for power and signal lines
Trends including the emergence of 5G telephony and the continued expansion of the Internet of things (IoT) are causing the density of electronic devices to increase dramatically. That increases the density of potential sources of electromagnetic interference (EMI) and the dangers associated with a lack of electromagnetic compatibility (EMC). The result is likely to be […]