Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) […]
Applications
Front-end mmWave IC combines PA, LNA, and switch
mmTron announced its first single-chip front-end IC for mmWave communications. Covering 24 to 30 GHz, the TMC252 integrates a power amplifier (PA), low noise amplifier (LNA), and transmit-receive switch on a single GaN IC that is available as a die or packaged in a 5 mm x 5 mm air-cavity QFN. The TMC252 is well-suited…
Wide range of wet aluminum electrolytic capacitors designed for industrial and consumer electronics
KYOCERA AVX has released the new surface-mount AEF Series wet aluminum V-chip electrolytic capacitors, which are designed for industrial and consumer electronics applications with high-density PCBs and qualified for industrial endurance levels. The series is available in 11 different case sizes spanning 0608 to 1216 and offers a wide range of capacitance values and voltage ratings extending from […]
What are the key design and selection considerations for MIL-SPEC connectors?
MIL-SPEC connectors are designed to operate reliably in challenging conditions and extreme environments. First developed in the 1930s for the US Armed Forces, military standard connectors are now used across multiple industries, from energy and aerospace to maritime and automotive. This article discusses key MIL-SPEC connector design requirements and reviews crucial connector selection criteria. It […]
Light pipes in reverse-mount design optimize assembly in difficult-to-reach locations
Visual Communications Company (VCC) announced its new LFBR Series 3mm Reverse Mount Press-Fit Rigid Light Pipes. These innovative reverse panel mount light pipes provide optimized light transmittance in regular and harsh environments. Built with a special long-life resin system, they are also UV-ready, making them ideal for a wide range of applications, including industrial, maritime, automation, […]
PCIe waveform generator card produces up to 20 sine waves
Spectrum Instrumentation has released a new firmware option for its range of versatile 16-bit Arbitrary Waveform Generators (AWGs) with sampling rates up to 1.25 GS/s and bandwidths up to 400 MHz. The new option costs $1200 and allows users to define 23 DDS cores per AWG-card, that can be routed to the hardware output channels. […]
Solving thermal challenges in EV charging
In the ever-evolving landscape of electric vehicle (EV) technology, the pursuit of faster charging speeds and increased efficiency stands as a paramount goal. As significant improvements in EV technology continue in tandem with growing government support, the demand for electric vehicles has never been higher. However, amidst this drive for progress, one critical aspect that […]
Analog and digital capabilities integrated into low-power transceiver
Arctic Semiconductor unveiled SilverWings. Representing a breakthrough in the industry, SilverWings is the first-ever 4×4 low-power transceiver offering multi-stage up and down conversion from digital to RF and RF to digital, empowering programmable and adaptable system designs. Leveraging Arctic’s renowned low-power architecture, SilverWings seamlessly integrates high-performance analog capabilities with high-bandwidth digital features, incorporating unique Digital-IF and High-IF […]
Dual-band positioning IC boosts accuracy in urban areas
u-blox has announced F10, the company’s first dual-band GNSS (Global Navigation Satellite Systems) platform combining L1 and L5 bands to offer enhanced multipath resistance and meter-level positioning accuracy. The platform caters to urban mobility applications, such as aftermarket telematics and micromobility. Applications that use GNSS receivers for accurate positioning are on the rise. Yet, current…
How can in-package optical interconnects enhance chiplet generative AI performance?
Generative artificial intelligence (AI) requires rapid and continuous movement of large amounts of data. In a growing number of instances, electrical input/output (I/O) connections between the ICs in chiplets are becoming a bottleneck to higher performance. Key electrical I/O performance barriers include power efficiency, bandwidth, and latency. This FAQ looks at the anticipated benefits of […]