The new MediaTek Dimensity 5G chipset family is the first 5G mobile SoC in its 5G family of chipsets and features an integrated 5G modem, The first Dimensity powered devices will start hitting the market in Q1 of 2020. The device also supports 5G two carrier aggregation (2CC CA) and boasts a throughput of 4.7Gbps…
Chipsets rev up gaming with super fast, responsive display and reduced lag
MediaTek today announced the launch of its Helio G90 series chipsets with Helio G90 & G90T exclusively designed to be the core of an incredible smartphone gaming experience. The Helio G90 Series combines the latest CPU and GPU cores with ultra-fast memory and massive AI performance to deliver fast, fluid action. And for even more gaming […]
SoC targets 5G smartphones with ARM Cortex-A77 CPU, Mali-G77 GPU, advanced AI processor
Today at COMPUTEX, MediaTek introduced a multi-mode, 7nm 5G system-on-chip (SoC) designed to power the first wave of high-end 5G smartphones. The integrated 5G chipset, with the MediaTek Helio M70 5G modem built in, packs world-leading technology into its compact design. It includes Arm’s newest Cortex-A77 CPU, Mali-G77 GPU and MediaTek’s most advanced AI processing unit (APU) […]
Combo chip handles both Wi-Fi 6 and AP+Bluetooth
MediaTek today announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology — Wi-Fi 6 (802.11ax) — for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home. MediaTek’s Wi-Fi 6 […]
Chipset brings AI processing to advance camera capabilities
MediaTek today announced the launch of the Helio P90 system-on-chip (SoC), which features APU 2.0, its new generation AI architecture for a great AI processing boost. With an impressive industry leading 1127 GMACs (2.25TOPs) performance, the Helio P90 boasts flagship device level AI power. The Helio P90 built-in processing unit – APU 2.0 – a leading […]
SoC hosts enhanced AI engine, CPU/GPU upgrades for better AI
MediaTek today announced the launch of the Helio P70 system-on-chip (SoC), with an enhanced AI engine combined with CPU and GPU upgrades for more powerful AI processing. Helio P70 also comes with upgraded imaging and camera support, a gaming performance boost and advanced connectivity features. The Helio P70 packs all these upgrades into an ultra power-efficient chipset to meet the most demanding […]
SoC chipset targets mid-market smartphones
MediaTek today unveiled its Helio A series, expanding its Helio family of feature-packed and power-efficient chipsets with the company’s new Helio A22 system-on-chip (SoC). MediaTek’s commitment to continuing to “change everything” can be seen throughout the “Advanced” Helio A series and its mission to power more innovative and more capable smartphones designed to meet the demands […]
Chipset to power “new premium” midrange mobile phones
MediaTek today announced the launch of the Helio P22, the latest addition to the Helio family of powerful and power-efficient chips for the mid-market. With Helio P22, MediaTek continues to expand its Helio P series family that brings high-end features users demand to mid-tier devices. MediaTek Helio P22 – which follows the successful launch of the P60 chipset […]
Chipset to power “new premium” midrange mobile phones
MediaTek today announced the launch of the Helio P22, the latest addition to the Helio family of powerful and power-efficient chips for the mid-market. With Helio P22, MediaTek continues to expand its Helio P series family that brings high-end features users demand to mid-tier devices. MediaTek Helio P22 – which follows the successful launch of the P60 chipset […]
DSP-based ASICs now in 7-nm FinFET technology
Today MediaTek announced a new addition to its ASIC lineup with a 56G SerDes IP chip available with silicon-proven 7nm FinFET process technology. MediaTek’s 56G SerDes is a high-performance DSP-based solution with PAM4 signaling. Altogether, it demonstrates best-in-class power efficiency, performance and die-area. By developing 7nm and 16nm silicon-proven IP it can integrate easily into […]
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