Dean Technology, Inc. announced the introduction of a new series of high voltage power supplies designed specifically for higher voltage applications needing a biasing module. The new UMR-A-10000 series, which is another extension of the existing UMR Collection of power supplies, offers output voltages up to 10kV, input voltages at 12 or 24V, and power […]
Cellular-based remote RF wireless charging platform eliminates IoT batteries
Powercast Corporation has created a unique cellular-based RF Power-Over-Distance Wireless Charging Platform, built around Sequans Monarch cellular IoT connectivity technology. Powercast will demonstrate the solution at Mobile World Congress in Las Vegas, September 28 – 30, booth w2.1226. Operating in the lower 600 – 900 MHz frequency bands licensed by mobile carriers, the Powercast cellular-based RF Wireless […]
Buck dc-dc converter IC features built-in MOSFET for automotive apps
ROHM Semiconductor today announced the BD9S402MUF-C, a new buck DC/DC converter IC with built-in MOSFET (switching regulator) for automotive applications such as infotainment and ADAS (Advanced Driver Assistance Systems) incorporating onboard sensors and cameras that are becoming more advanced. In recent years, safety requirements in the automotive sector have increased as technological innovations in accident prevention and autonomous driving continue […]
Half-brick 200/300-W converters feature 43-160-V inputs for rail, industrial apps
TDK Corporation announces the introduction of the 200W and 300W rated TDK-Lambda CN-B110 series of half brick DC-DC converters. Capable of operating from a wide input voltage of 43 to 160Vdc the converters are compatible with 72Vdc or 110Vdc nominal railway systems. Applications include rolling stock, railway trackside equipment, robotics, AGVs, and scientific research equipment. […]
Automotive radar transceivers feature improved phase noise, output power, noise figure
NXP Semiconductors released its 2nd generation RFCMOS radar transceiver family to production. The TEF82xx is the successor to the market-proven TEF810x, which has already shipped tens of millions of units. Optimized for fast chirp modulation, the device supports short-, medium- and long-range radar applications, including cascaded high-resolution imaging radar. It enables 360-degree sensing for critical […]
Flyback PWM controller ICs run in quasi-resonant mode to boost efficiency
Elevation Semiconductor announced the release of its two high-efficiency power ICs with smaller footprints for fast-charging solutions. The HL9510 and HL9512 are flyback PWM controller ICs that operate in a quasi-resonant (QR) mode to significantly enhance the system efficiency and power density. Both ICs offer constant output voltage regulation through the optocoupler feedback controller or […]
IDE enables ECU-level automotive software development
Renesas Electronics Corporation launched a new integrated development environment that allows engineers to rapidly create software for automotive ECUs (Electronic Control Units) containing multiple hardware devices. The fully integrated environment supports co-simulation, debug and trace, high-speed simulation, and distributed processing software over multiple SoCs (System-on-Chips) and MCUs (Microcontrollers)—all without the need for actual hardware. This […]
Repeater ICs support MIPI D-PHY 1.2 protocol for mobile, IoT apps
Diodes Incorporated announced the latest addition to its broad portfolio of ReDrivers with the release of a 1.8V low-power, 4 data lanes 2.5Gbps ReDriver. The DIODES PI2MEQX2505 is the first ReDriver in the industry to support the MIPI D-PHY 1.2 protocol and is targeted at mobile and IoT applications. The PI2MEQX2505 consumes 135mW in active mode, […]
Heat-pump temp sensors optimized for automotive use
TDK Corporation presents the new B58101A0109A* (HP100) series of heat pump sensors for measuring the refrigerant temperature indirectly via the pipes’ surface temperature. The NTC-based sensors are specifically designed to meet automotive requirements. The standard for pipe diameters of 12.8 mm, this clip-on design can operate in harsh environments from -40 °C to +150 °C […]
High-rez line-scan imaging modules deliver 900 dpi
Teledyne DALSA is pleased to introduce AxCIS, a new family of high-speed and high-resolution fully integrated line scan imaging modules. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all in one, offering a lower-cost inspection system for many demanding machine vision applications. AxCIS is powered by Teledyne’s new quad linear CMOS image […]