Resistivity and its inverse, conductivity, are different from the more familiar metrics, resistance and its inverse, conductance. Resistivity is applicable to types of materials. For example, glass and carbon have specific resistivities whereas a particular carbon resistor of a given length, diameter and temperature has a specific resistance. In a nutshell, resistance is defined as […]
FAQ
Sensor fusion – How does that work?
Each sensor type, or modality, has inherent strengths and weaknesses. Sensor fusion is the process of bringing together inputs from multiple sensors to form a single model or image of the environment around a platform. The resulting model is more accurate because it balances the strengths of the various sensors. Sensor fusion brings the data […]
Advanced power electronics packaging
The trends in advanced power electronics packaging mirror the overall packaging trends in the electronics industry. Those trends include adopting chip-scale packaging (CSP), 3D packaging, 3D printing (also called additive manufacturing), and advanced thermal management materials. In power electronics, these trends are being heavily influenced by the adoption of gallium-nitride (GaN) and silicon-carbide (SiC) wide […]
Squash 1/f noise with zero-drift amplifiers
There is a device that squashes all the 1/f voltage and current noise calculations with a chopper amplifier algorithm that corrects offset and drift characteristics. These amplifiers are zero-drift, auto-zero, or choppers that all achieve nanovolt-level offsets and extremely low offset drifts due to time and temperature. But back to our noise discussion, these devices […]
What are the applications of 3D and 4D printed electronics?
3D printing is the fabrication of a three-dimensional object under computer control, with one or more materials being added layer by layer. 3D printing, or additive manufacturing, is used across various electronics applications, including circuit boards, energy storage devices, actuators, and sensors. It can be implemented using a variety of technologies, including selective laser sintering […]
Packaging options and advances for digital ICs
The packaging options for digital ICs (and the related buzz words and acronyms) continue to multiply. Advanced digital ICs such as microprocessors, field-programmable gate arrays (FPGAs), and application specific custom ICs (ASICs) are offered in a wide array of package styles such as: QFN, quad flat no leads; FBGA, fine pitch ball grid array; WLCSP, […]
Free-space optical links, Part 3: Standard units
Free-space optical links provide a reliable, cost-effective, and quick way to link two fixed communication nodes located a few kilometers apart. The previous part of this article looked at real-world issues that make a practical FSO link a design challenge. This part looks at a family of commercially available FSO systems. Q: Can you build […]
RTK navigation technologies for autonomous vehicles
Real-time kinematic positioning brings high-accuracy to the autonomous vehicle industry without breaking the bank. James Fennelly • ACEINNA Inc. It’s no secret that a variety of technologies must work together smoothly and reliably to make autonomous vehicles possible. The technology mix includes inertial measurement units (IMUs), GPS/GNSS, radar, lidar, IR and vision sensors, as well […]
3D printing for 5G systems
MIMO antennas, waveguides, traveling wave tubes, and RF substrates are fabricated using various 3D printing technologies. For example, 3D printing has been used to produce highly dense and integrated waveguide signal interconnects modules in a single monolithic unit. By printing the waveguide modules in one component, the part count was significantly reduced from tens or […]
Navigating in-vehicle network communications securely
Hardware security modules help thwart hackers bent on getting control of EVs. Todd Slack • Microchip Technology Roughly half of all new vehicles sold this year will be connected vehicles, and estimates are that figure will rise to around 95% by 2030. Those connections via Bluetooth, USB, LTE, 5G, Wi-Fi, and so forth have dramatically […]