Wirepas and Silicon Labs today announced they have joined forces to deliver a combined hardware and software solution that unleashes the potential of multiprotocol connectivity for mesh networks. Building on their growing relationship and success in the smart metering market, Wirepas and Silicon Labs have collaborated to create an industry first: a truly concurrent multiprotocol switching solution with one ERF32 […]
Microcontroller Tips
New Standard Interface for Advanced SPICE capabilities handles complex physics for digital, RF designs
The Silicon Integration Initiative Compact Model Coalition has released the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions. OMI allows circuit designers to simulate and analyze such important physical effects as self-heating and aging, and perform extended design optimizations. It is based on TMI2, the TSMC Model Interface, which […]
Twelve-inch color E-paper display includes integrated controller electronics
Pervasive Displays (PDi) today announced the launch of a new high resolution three color 12-inch Electronic Paper Display (EPD) module featuring an internal timing controller (iTC), the E2B98FS081. ( https://www.pervasivedisplays.com/products/122 ) The energy efficient, multi-colored display is a good fit for retail ESL (electronic shelf labeling), Point of Sale, office automation, and healthcare market applications. “These new […]
Newark element14 launches IoT device/data monitoring bundle focused on sensing
Newark element14 today announced an exclusive sales and marketing deal for Symbisa, an Excel-integrated IoT device built by UK firm Hanhaa. Symbisa combines the possibilities of IoT with the power of Microsoft Excel, offering developers and IT professionals an entirely new way to build Internet of Things (IoT) applications. A Symbisa module is an all-in-one, always-connected […]
Considerations in PCB layout guidelines
A Printed Circuit Board (PCB) layout, in its most basic form, is a means to transfer a circuit from a breadboard to a more stable and permanent physical form. Whereas entire books and college coursework have been dedicated to PCB layout, what follows is a short overview of what to consider when making a PCB. […]
Expansion board broadens capabilities of RISC-V development board
Microsemi Corporation announced the launch of the HiFive Unleashed Expansion Board, its latest collaboration with SiFive, the first fabless provider of customized, open-source-enabled semiconductors. Leveraging the two companies’ strategic relationship as part of Microsemi’s Mi-V RISC-V ecosystem, the new expansion board broadens the capabilities of SiFive’s HiFive Unleashed RISC-V development board, further enabling software and […]
Expansion pack for STM32 MCUs helps implement security features
Consolidating secure boot, secure firmware update, and secure-engine services in a convenient STM32Cube expansion software package, X-CUBE-SBSFU v.2.0 from STMicroelectronics helps product developers fully utilize the security features of STM32 microcontrollers to protect connected devices like IoT endpoints and help manage their life-cycle. By establishing a root of trust in the microcontroller, X-CUBE-SBSFU Secure Boot enables protection […]
100BASE-T1 Ethernet PHY transceiver targets space-constrained automotive apps
Texas Instruments introduced a new automotive Ethernet physical layer (PHY) transceiver that cuts the external component count and board space in half and consumes as little as half the power of competitive solutions. The DP83TC811S-Q1’s support for serial gigabit media independent interface (SGMII), small packaging and integrated diagnostic features enable designers to bring greater intelligence […]
Chip design tools now handle TSMC 5 and 7-nm FinFET IC processes
Mentor, a Siemens business, has announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified by TSMC for the latest versions of TSMC’s 5nm FinFET and 7nm FinFET Plus processes. Mentor also announced it has updated its Calibre nmPlatform tools in support of TSMC’s Wafer-on-Wafer (WoW) stacking technology. These Mentor tools and TSMC’s […]
Driver for optical transceivers exhibits low THD
Integrated Device Technology, Inc. introduced its new GX76470 64G linear driver, in die form, for optical integrated modules, for 400G/600G coherent applications. Driven by the ever-increasing amount of digital information, data centers are expanding rapidly across the globe and continuous innovation is required to accommodate an annual traffic growth of 27% and to facilitate 3-5 […]