BrainChip Holdings Ltd., a leading developer of software and hardware accelerated solutions for advanced artificial intelligence and machine learning, today announced the release of its hardware acceleration board, BrainChip Accelerator. BrainChip Accelerator is an 8-lane, PCI-Express add-in card that increases the speed and accuracy of the object recognition function of BrainChip Studio software by up to […]
Microcontroller Tips
Firmware development framework for PIC32 MCUs available for free download
MPLAB Harmony 2.0, the fully featured firmware development framework for PIC32 microcontrollers, is now available as a free download from Microchip Technology Inc. The significant update to the award-winning software platform enables customers to create smaller and more efficient code equaling faster and more cost-effective devices. In addition to better quality code, the update has added […]
Cache coherent interconnect for accelerators test chip will use 7-nm FinFET process technology
Xilinx, Arm, Cadence Design Systems, Inc., and TSMC announced a collaboration to build the first Cache Coherent Interconnect for Accelerators (CCIX) test chip in TSMC 7nm FinFET process technology for delivery in 2018. The test chip aims to provide a silicon proof point to demonstrate the capabilities of CCIX in enabling multi-core high-performance Arm® CPUs […]
Voice-over-powerline module targets public address, security systems
Renesas Electronics Corporation announced a new voice-over-power line communication (PLC) solution that enables both data communication and voice communication capabilities over existing power networks. The PLC solution reduces the amount of internal wiring required in buildings, enabling reduced implementation and maintenance costs for public address (PA) systems and security systems. The new solution consists of Renesas’ PLC software modem […]
ESD protection diodes target mobile device interfaces
Toshiba America Electronic Components, Inc. (TAEC) has introduced a new bidirectional electrostatic discharge (ESD) protection diode for semiconductor devices used in mobile device interfaces. The DF2B7ASL utilizes snapback characteristics, providing low dynamic resistance and superior protective performance to safeguard against static electricity and noise. Housed in an ultra-compact package (0.32×0.62mm), the DF2B7ASL is designed for applications […]
Color display module/touch interface ganged with Android operating system for WaRP7 development platform
Farnell element14, the Development Distributor, has introduced an integrated color display module with touch interface, along with the Android SDK (software development kit), for the WaRP7 development platform, which targets IoT and wearable applications. The WaRP7 LCD module incorporates a standard MIPI display with DSI (display serial interface) and I2C (inter-integrated circuit) interfaces and is […]
Real-time voice-enhancement tech works with DSP design software
Synopsys, Inc. and Alango Technologies today announced that Alango Technologies’ Voice Enhancement Package (VEP) software has been optimized for Synopsys’ DesignWare® ARC® Data Fusion IP Subsystem. The VEP is a suite of real-time software DSP technologies designed for improving speech recognition performance in voice-controlled multimedia devices. The ARC Data Fusion IP Subsystem is a highly integrated hardware and software IP […]
Flash storage, comm software works with Xilinx Zynq-7000 All Programmable SoCs
HCC Embedded, experts in software for securely storing and communicating embedded data, has added support for the Xilinx Zynq-7000 All Programmable system-on-chip (SoC) family of devices. Developers using Xilinx Zynq-7000 SoCs now have access to HCC’s entire suite of advanced flash storage and communications middleware. Solutions for Zynq SoCs include fail-safe flash file systems; MISRA-compliant TCP/IP, TLS, […]
Chip design CAD software supports integrated fan-out advanced packaging, chip-on-wafer-on-substrate packaging technologies
Mentor, a Siemens business, today announced several enhancements to its Calibre® nmPlatform, Analog FastSPICE™ (AFS™) Platform, Xpedition® Package Integrator and Xpedition Package Designer tools in support of TSMC’s innovative InFO integrated fan-out advanced packaging and CoWoS® chip-on-wafer-on-substrate packaging technologies. The TSMC InFO and CoWoS 3D packaging technologies enable customers to mix multiple silicon dice on a single device and […]
Chip design CAD system supports 7-nm FinFET Plus and 12-nm FinFET process technologies
Mentor, a Siemens business, today announced certification for TSMC’s 12nm FinFET Compact Technology (12FFC) and the latest version of 7nm FinFET Plus processes for its Mentor Calibre® nmPlatformand Analog FastSPICE™ (AFS™) Platform. Nitro-SoCTM place and route system is also certified to support TSMC’s 12FFC process technology. “TSMC is pleased to work closely with Mentor, which continues to increase its […]