Autonomous vehicles must operate in a world of uncertainties. Validation platforms are now capable of determining whether behavior is correct given complex contextual attributes. David Fritz, Mentor, A Siemens Business There is an interesting dashcam video circulating in the autonomous vehicle (AV) development community of a Tesla-paid test driver coming up on what the driver […]
Understanding low-power checks and how to use them
by Aijaz Fatima, Mentor, a Siemens business We live in a shrinking world, and like so much else, the size of ICs is shrinking too. The small size of an IC has many advantages, but it increases the power density of the IC, which leads to many concerns. An IC with a high power density […]
How to structure SystemVerilog for reuse as Portable Stimulus
by Matthew Balance, Mentor, a Siemens Business In our previous article, The Nuts and Bolts of Verification: Recasting SystemVerilog for Portable Stimulus, we described how verification teams can jumpstart portable stimulus test description creation using existing SystemVerilog constructs and principles. Now, switching from analogy to idiom, we’ll dive into the “nuts and bolts” of how […]
Enabling embedded devices for the IoT
Automated onboarding and security features now help speed the integration of embedded devices into IoT systems. Arvind Raghuraman, Mentor Graphics, a Siemens company As the internet of things has evolved it has also grown more complicated. There are myriad choices when it comes to choosing the right cloud platform, cloud apps, device run-time components, communication […]
The nuts and bolts of verification: Recasting SystemVerilog for Portable Stimulus
by Matthew Balance, Mentor, a Siemens Business Nuts and bolts. So prosaic, yet so fundamental and essential. They can be reused, mixed-and-matched in endless ways. All those old jars and tins full of leftover nuts, bolts, and screws have saved many trips to the hardware store. Yet, if not for standardized gauge, thread count, and […]
Signal Integrity and high-speed design challenges: interview with Mentor’s Todd Westerhoff
At DesignCon 2019, I met with Todd Westerhoff, HyperLynx high-speed design analysis product manager at Mentor, a Siemens Business. Todd has over 38 years of experience in systems modeling, simulation and signal integrity. Prior to joining Mentor, Todd held senior technical and management roles at SiSoft, Cisco and Cadence. We spent time talking about current […]
Embedded Computing LEAP Awards winners announced at gala dinner
At the LEAP Awards dinner gala in Costa Mesa, Calif., the following companies were awarded trophies in the category of Embedded Computing. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. Judges rated candidates on categories that included societal impact, industry impact, technical sophistication, creativity, and value […]
Finalists announced for prestigious power electronics LEAP Awards
Four finalists were announced Friday for the inaugural LEAP Awards’ Power Electronics Category, comprising a broad array of new advances in power semiconductor and power management technology. The competition was scored by a panel of independent technical/engineering judges. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. […]
Finalists announced for T&M LEAP Awards
Four finalists were announced Friday for the inaugural LEAP Awards’ Test & Measurement Category, comprising a broad array of new advances in instrumentation technology. The competition was scored by a panel of independent technical/engineering judges. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. Judges rated candidates […]
IC design software includes automotive-grade automatic test pattern generation technology
Mentor, a Siemens business, today announced the availability of automotive-grade automatic test pattern generation (ATPG) technology for its Tessent TestKompress software. The new technology includes a suite of fault models and test pattern generation applications that target defects in ICs at the transistor and interconnect levels – in the process helping customers capture defects that […]
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