by Matthew Balance, Mentor, a Siemens Business In our previous article, The Nuts and Bolts of Verification: Recasting SystemVerilog for Portable Stimulus, we described how verification teams can jumpstart portable stimulus test description creation using existing SystemVerilog constructs and principles. Now, switching from analogy to idiom, we’ll dive into the “nuts and bolts” of how […]
Enabling embedded devices for the IoT
Automated onboarding and security features now help speed the integration of embedded devices into IoT systems. Arvind Raghuraman, Mentor Graphics, a Siemens company As the internet of things has evolved it has also grown more complicated. There are myriad choices when it comes to choosing the right cloud platform, cloud apps, device run-time components, communication […]
The nuts and bolts of verification: Recasting SystemVerilog for Portable Stimulus
by Matthew Balance, Mentor, a Siemens Business Nuts and bolts. So prosaic, yet so fundamental and essential. They can be reused, mixed-and-matched in endless ways. All those old jars and tins full of leftover nuts, bolts, and screws have saved many trips to the hardware store. Yet, if not for standardized gauge, thread count, and […]
Signal Integrity and high-speed design challenges: interview with Mentor’s Todd Westerhoff
At DesignCon 2019, I met with Todd Westerhoff, HyperLynx high-speed design analysis product manager at Mentor, a Siemens Business. Todd has over 38 years of experience in systems modeling, simulation and signal integrity. Prior to joining Mentor, Todd held senior technical and management roles at SiSoft, Cisco and Cadence. We spent time talking about current […]
Embedded Computing LEAP Awards winners announced at gala dinner
At the LEAP Awards dinner gala in Costa Mesa, Calif., the following companies were awarded trophies in the category of Embedded Computing. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. Judges rated candidates on categories that included societal impact, industry impact, technical sophistication, creativity, and value […]
Finalists announced for prestigious power electronics LEAP Awards
Four finalists were announced Friday for the inaugural LEAP Awards’ Power Electronics Category, comprising a broad array of new advances in power semiconductor and power management technology. The competition was scored by a panel of independent technical/engineering judges. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. […]
Finalists announced for T&M LEAP Awards
Four finalists were announced Friday for the inaugural LEAP Awards’ Test & Measurement Category, comprising a broad array of new advances in instrumentation technology. The competition was scored by a panel of independent technical/engineering judges. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. Judges rated candidates […]
IC design software includes automotive-grade automatic test pattern generation technology
Mentor, a Siemens business, today announced the availability of automotive-grade automatic test pattern generation (ATPG) technology for its Tessent TestKompress software. The new technology includes a suite of fault models and test pattern generation applications that target defects in ICs at the transistor and interconnect levels – in the process helping customers capture defects that […]
Direct comm between Tessent DFT software and Teradyne testers accelerates silicon bring-up
ATE-Connect technology is now hosted in Tessent SiliconInsight product for IC debug and bring-up. The ATE-Connect technology creates an industry-standard interface to eliminate communication barriers between proprietary, tester-specific software and design-for-test (DFT) platforms. The new technology accelerates debug of IJTAG devices, helps speed up product ramps, and reduces time-to-market for products in 5G wireless communications, […]
Thermal simulation package brings CFD to autonomous electric vehicle design
New Simcenter software for thermal simulation of Autonomous Electric Vehicles (AEVs) is said to be the first such package engineered to address critical, thermal-driven challenges associated with AEV design. “Strategy Analytics expects that the vast majority of self-driving cars will feature electrified powertrains,” said Ian Riches, executive director, Automotive Practice for Strategy Analytics. “The OEMs […]
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