Power supplies from phone chargers to EVs to industrial machinery rely on semiconductors, either in discrete packages or integrated into power modules, to deliver power. APEC 2024 was full of power sources and components. The roundup below highlights regulators, switches, and power semiconductors. We also highlight wireless power delivery and chargers. Be sure to see […]
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How current sensing impacts electric vehicles: part 2
Part 1 of this blog addressed current shunts and Hall-effect sensor designs. This part discusses current transformers and new technology options such as magnetoresistance and even diamond quantum sensors. One of the major issues in today’s electric vehicles (EVs) is the ongoing evolution of technology with the standards evolving as well. In the 100+ years […]
How does a finger unlock a door?
At Sensor Expo 2019, Marcia Ratton from TDK InvenSense demonstrates how the UltraPrint Sensor (TCFS-3000) precisely identifies a finger print. Integrated into a door lock, the image from the sensor is displayed on a screen to demonstrate the clarity and details of the image. The ultrasonic fingerprint imaging uses proprietary InvenSense, a TDK Group company, […]
Data book covers NTC thermistors
TDK Corporation now offers the completely revised data book for EPCOS NTC thermistors. Product highlights include NTC elements for measuring temperatures of up to 650 °C. They are suitable for use in combustion engines, for example, where they help to improve the combustion control for minimal environmental impact. They can be used in applications such as […]
Metal oxide disk varistors work up to 105 °C
TDK Corporation presents leaded EPCOS metal oxide disk varistors, which have now been approved for an increased operating temperature of 105 °C (previously 85 °C). The reason for this is the recertification of the B722* series of varistors in accordance with UL 1449, 4th Edition, and IEC 61051. Raising the permissible operating temperature to 105 […]
Chip beads and inductors carry robust soft terminations
TDK Corporation presents the world’s first multilayer chip beads and inductors with the innovative soft-termination technology that is already proven in TDK MLCCs. The external electrodes of the new KMZ1608 and KPZ1608 series of chip beads and the KLZ1608 and KLZ2012 series of inductors feature a conductive resin layer that offers effective protection against board […]
The post Chip beads and inductors carry robust soft terminations appeared first on Analog IC Tips.
Miniaturized LC filters suppress EMI in smartphones, base stations
TDK Corporation presents the MEM1005PP251T – a new LC filter for EMI suppression. With dimensions of just 1.0 x 0.5 x 0.35 mm the filters are ideally suited for use in smart phones and base stations. Volume production began in March 2017. The usual method for suppressing interference in the communication frequency bands of smart […]
The post Miniaturized LC filters suppress EMI in smartphones, base stations appeared first on Microcontroller Tips.
300W models added to 200 – 425VDC input DC-DC converter series
TDK Corporation announces the introduction of 300W models to the TDK-Lambda PH-A280 series of DC-DC power modules with high voltage DC input. Operating from a wide range DC input of 200 to 425VDC, which is widely used in HVDC (High Voltage DC Current) applications, the PH-A280 range now includes 50, 75, 100, 150 and 300W […]
The basics of thermistors in thermal management
Thermistors can reliably switch in thermal protection to keep power electronics cool. SONJA BROWN | EPCOS, A TDK GROUP CO. ALL SEMICONDUCTORS generate thermal losses, of course. Thermal losses in power semiconductors can range from a few watts to multiple kilowatts. In heatsinks, the conductive capability is typically measured in °K/W. The smaller the conductive […]
Qualcomm and TDK announce launch of joint venture for delivery of RF integrated systems
Qualcomm Incorporated and TDK Corporation today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such […]
