TE Connectivity (TE) has launched its new ChipConnect internal faceplate-to-processor (IFP) cable assemblies. Designed for Intel Omni-Path Architecture (OPA), TE’s ChipConnect assemblies mate directly with LGA 3647 sockets at the processor and Intel Omni-Path internal faceplate transition (IFT) ports at the faceplate for 25 Gbps speeds. These new cable assemblies reduce system design time and […]
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TE Connectivity launches OCP-Compliant U.2 right-angle receptacle
TE Connectivity (TE) has launched a new U.2 SFF-8639 right angle SAS connector with the highest reliability to meet the Open Compute Project (OCP) Lightning Hardware System Specification for Facebook’s PCIe-based storage unit design. This new right angle configuration complements TE’s existing portfolio of U.2 SFF-8639 connectors, providing more design options to support both SAS […]
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TE Connectivity releases 3-in-2 memory card connectors
TE Connectivity (TE) released its 3-in-2 card connector, for enabling SIM and micro SD card connectivity in mobile phones, tablets, ultraportable devices and personal computers. This card connector’s space-efficient design features two cavities with the flexibility to accept either two SIM cards or one SIM card and one micro SD card. It saves about 20% […]
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Small 600-A high-voltage contactor features integrated current sensor
TE Connectivity (TE) recently introduced the KILOVAC current-sensing (KCS03) High-Voltage contactor, featuring an integrated current sensor with current trip function. KILOVAC current-sensing contactors eliminate the need for discrete current sensors, saving weight and space in military and commercial electric vehicles, power distribution and energy storage systems. TE’s current-sensing contactors simplify configuration needs within rugged applications […]
Molex and TE Connectivity announce Dual Source Alliance for high-speed I/O and backplane connectors
Two of the largest manufacturers of high-speed I/O and backplane manufacturers, Molex and TE Connectivity today announced that they have formed a Dual Source Alliance (DSA) agreement to each produce a new generation of high-speed input/output (I/O) and backplane connectors, and cable assemblies for data communications applications. Molex and TE will collaborate on the launch […]
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High-speed cables from TE offer signal integrity in IEEE 1394 applications
TE Connectivity Ltd., Harrisburg, Pa., launched new Raychem high-speed data transmission cables for IEEE 1394 applications. Designed for use with military ground, military and commercial aerospace and marine systems,…
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Using pressure sensors to make other measurements
by Randy Frank, Contributing Editor Many applications use pressure sensor measurements to calculate other key parameters such as flow, altitude, water column height, fluid depth, weight and more….
200-A, 28-Vdc contactors for aerospace and defense applications
TE Connectivity Ltd. is releasing its K200 series contactors, a small, lightweight, and efficient 200-Amp 28 VDC power switching solution for stringent 28 V DC aerospace and defense applications. The…
TE Connectivity introduces Half-Size VITA 66.4 module
TE Connectivity (TE) announces a new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the…
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DPO configuration connectors eliminate midplane connectivity
TE Connectivity (TE) today announced its new STRADA Whisper direct plug orthogonal (DPO) connectors, which enable designers to eliminate midplane connectivity to reduce costs and improve airflow in…
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