The new HiperLCS-2 chipset brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98% efficiency and 40% component-count reduction in LLC resonant power converters up to 250 W, eliminating bulky heatsinks or unreliable optocouplers. One-half of the dual-chip solution is the HiperLCS2-HB half-bridge power device utilizing […]
Security suite covers NVIDIA Jetson edge AI platforms
Sequitur Labs announced a new release of its EmSPARK Security Suite for the NVIDIA Jetson edge AI platform, featuring a generally available development kit and pre-built Trusted Applications that provide robust security features and functions needed to protect AI models at the edge. Expanding Sequitur’s support for the NVIDIA Jetson platform, the latest release features […]
Cloud-native automation of testing routines integrates data from across 5G network lifecycle to increase speed and accuracy
Infovista announced Precision Drive Testing to bring an ML/AI data-driven approach and automation to network testing, significantly reducing the cost and time of 5G network testing. The patent-pending Precision Drive Testing leverages 5G network, service and customer data, and ML/AI techniques to increase the speed and accuracy of the 5G testing process. Infovista’s cloud-based Precision…
GNSS receivers to get OSNMA functions
Septentrio announced the release of OSNMA functionality on their mosaic GNSS receiver modules. OSNMA (Open Service Navigation Message Authentication) offers end-to-end authentication on Galileo’s civilian signals, protecting receivers from GNSS spoofing attacks. Spoofing is a malicious form of radio interference, where faulty positioning information is sent to the receiver. For the last 2 years, Septentrio […]
Industrial computers feature AMD Zen 3 Ryzen 5000 APUs
ASRock Industrial announces the 4X4 BOX-5000 Series Mini PCs 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, with enhancement powered by AMD Zen 3 Ryzen 5000 U-Series APUs- Ryzen 7 5800U, Ryzen 5 5600U, and Ryzen 3 5400U up to 8 cores/16 threads to energize performance, energy efficiency, and lower latency. Featuring a powerful yet compact […]
16-Core SOM platform features compact footprint
SolidRun announces its all-new family of LX2-Lite SOMs and CLEARFOG LX2-Lite Development Platform, based on the powerful Layerscape LX2162A SoC from NXP Semiconductors. With a footprint measuring just 58mm x 48mm, or about 25% the size of the standard COM Express 7 solution, the LX2-Lite Mini SOM is the smallest 16-core SOM platform in the […]
4G antennas feature compact footprint
Antenova Ltd has halved the footprint of its 4G cellular antennas with its latest offering, the Pharaoh SMD antenna. Designed for small PCBs, Antenova’s Pharaoh antenna (P/N SR4L073) covers all 4G frequencies: 698 – 824 MHz, 824-960 MHz, 1710-2170 MHz, 2300-2400 MHz, and 2500-2690 MHz. The Pharaoh’s small ground requirement offers designers a huge advantage […]
Solid-state laser arrays target sensing apps
Lumentum Holdings Inc. announced the M Series multi-junction VCSEL arrays for next-generation automotive, industrial LiDAR, and 3D sensing applications and the availability of the first M Series product, the M51-100 905 nm 70 W multi-junction VCSEL array. Lumentum’s automotive qualified, high-performance M Series features peak powers suited for short- and long-range advanced mobility and industrial LiDAR applications. […]
Thick-film resistors feature high temperature stability
Commercial and industrial power electronics increasingly demand robust power supplies with high stability and low thermal resistance. For these requirements, standard chip resistors may not be the best solution. Wide terminal chip resistors, such as Stackpole’s RMCW, provide terminations on the long sides of the chip to provide better current handling and thermal resistance. The […]
Hall switches feature ASIL B safety ratings
TDK Corporation has upgraded its Micronas Hall-effect switch family, HAL 15xy, for automotive and industrial applications – All now defined as SEooC (Safety Element out of Context) ASIL B-ready, according to ISO 26262. Modules equipped with HAL 15xy can more easily fulfill higher safety criteria in automotive applications such as brake fluid level sensing, seat […]