Bel Fuse Inc announced the release of their Type 0AMA series of 3×8.4mm Fast-acting Fuses. These competitively priced fuses are designed for barrier circuits in intrinsic safety applications relating to hazardous locations, particularly medical and industrial environments. With the introduction of this series, Bel Fuse expands its portfolio to include robust and reliable products capable […]
Crystals and oscillators now AEC-Q qualified
Suntsu Electronics provides AEC-Q200 and AEC-Q100-certified crystals and oscillators to help our customers create what’s next in every field, including the automotive industry. Our production facility is IATF 16949 certified, allowing us to meet the stringent standards and extended temperature range qualifications required for automotive electrical components. You can rely on us to provide exactly […]
Cable assembly line expanded to include multiple configurations
Molex has extended its cable-assembly product line with the addition of innovative solutions from I-PEX. Together, the organizations offer I-PEX MHF 4L LK and MHF I LK cable assemblies, which are available in multiple configurations using standard MHF receptacles and Molex RF connector interfaces. The MHF I Series of micro-RF coaxial connector systems takes advantage […]
PPI adds smallest 100 nF RF capacitors
Passive Plus (PPI) has expanded its Broadband Capacitor line to include the industry’s smallest .010”x.005” Broadband part characterized for RF performance. The 01005BB104 series has been expanded and a new part is now offered with a 10V Rating. The 01005BB104MW100 (100nF) Broadband multilayer ceramic capacitor specifications. Typical Applications include Optoelectronics / high-speed data, ROSA/TOSA (Transmit /…
Lattice FPGA’s integrate SiTime clock system on chip
SiTime Corporation announced that it will provide its precision timing solutions to Lattice Semiconductor, the low-power programmable leader. The SiTime devices, a Cascade MEMS-based Clock-System-on-a-Chip (ClkSoC), and an Emerald OCXO or Elite X Super-TCXO are incorporated into Lattice’s new synchronization hardware development platform. Key features of the Cascade SiT95141 Clock-System-on-Chip Family include: Integrated MEMS resonator, enabling designers…
Torque sensor provides analog and Ethernet outputs
New low-capacity models of Sensor Technology’s non-contact torque sensors offer accurate measurement down to 200mNm (0.2Nm), for applications such as precision and high-speed robots, medical devices, prostheses and implants, small drives, and micro motors. The new TorqSense SGR 510/520 torque sensors cover capacities from 0.2Nm to 1Nm, making the full range 0.2Nm to 13,000Nm. The […]
Mouser co-sponsors FIRST Robotics Championship
Mouser Electronics, Inc. is continuing its co-sponsorship of the FIRST Robotics Competition, which inspires innovation and fosters well-rounded life capabilities in tens of thousands of young people every year. Mouser will be the exclusive sponsor of the Hall of Fame at the 2023 FIRST Championship, April 19-21 in Houston. The Hall of Fame honors the […]
PMIC recharges battery or capacitor using energy harvesting
Nexperia announced an expansion to its range of Power ICs with Energy Harvesting solutions to simplify and enhance the performance of low-power Internet of things (IoT) and other embedded applications. The NEH2000BY is a high-performance power management integrated circuit (PMIC) that recharges a battery or storage capacitor using energy harvested from ambient sources, such as […]
Agreement targets 3.2 Tb/sec co-packaged optical module or cable
OIF continues to promote collaboration and coordination among different players in the supply chain and drive efforts to foster a co-packaging ecosystem to support innovative applications. An industry-first, the OIF-Co-Packaging-3.2T-Module-01.0 – Implementation Agreement for a 3.2Tb/s Co-Packaged (CPO) Module defines a 3.2T co-packaged module that targets Ethernet switching applications utilizing 100G electrical lanes and provides backward compatibility…
Voice processor offers always-on functionality at <55mW
XMOS announces xcore-voice: a complete voice solution built on xcore platform hardware, software, and tools. The solution provides voice pipeline example designs using XMOS industry-proven audio front-end, incorporating far-field processing and support for third-party ISV voice algorithms. Freeing up the voice processing workload from the SoC, the versatile platform behaves like a voice processor […]