Sarcon CF210A is the newest Fujipoly thermal gap filler and incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. The carbon fibers allow for higher thermal conductivity (21 W/m•K) while remaining compliant. Sarcon CF210A’s compliance is closer to a much lower conductivity gap filler such as Sarcon PG25A. While the thermal […]
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Silicone gap filler offers enhanced options for power applications
Sarcon GR25B is an advanced silicone, gel-like thermal interface material delivers a thermal conductivity of 2.5 W/m•K and is a widely used choice for higher power electronics applications. GR25B is offered in double sticky surfaces, hardened surfaces for easier handling, with polyester mesh to prevent stretching or with both hardened surface and mesh for more […]
Silicone gap filler transfers heat and absorbs electromagnetic waves
A new thermal interface material also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of SARCON EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for […]
High-performance thermal interface material features extreme compressibility
SARCON PG130A from Fujipoly is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also helps reduce stress on the PCB during […]
Heat-transfer compound boasts low thermal resistance
SARCON SPG-70A is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.2 mm. […]
Dispensable thermal gap filler provides 2 to 7 W/m-K thermal conductivity
New 2 to 7 W/m-K dispensable thermal interface gap fillers are dispensable are dispensable thermal interface materials suitable for many types of applications, including thin bond line and gap filler applications. Both silicone and non-silicone options are available as well as one-part and two-part options. Various types of dispensing systems range from low-cost approaches for […]
Non-silicone grease provides low thermal resistance
New 5 and 6W/m-K SARCON thermally conductive greases, SARCON SG-50NS and SG-60NS, offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as well as the non-silicone advantages of no creep or migration. SG-50NS and SG-60NS are high-performance, thermal greases designed to meet the thermal, reliability and […]
Form-in-place thermal gap filler contains no silicone
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low-viscosity, silicone-free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.5 mm. This allows […]
Low oil-bleed/specific-gravity gap filler pad material in sheets, custom shapes
Sarcon GR14B from Fujipoly is a low oil-bleed/specific-gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is a candidate for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap […]
Thermal interface materials sport low compression force at high compression rates
SARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus thermal gap […]
