GL Communications Inc. addressed the press regarding their new 5G protocol analysis tool. GL’s 5G Protocol Analyzer enables real-time monitoring and capture of 5G network traffic, allowing you to effortlessly gather and analyze data across the network. The 5G Protocol Analyzer is an optional application for PacketScan. PacketScan is a protocol analysis software supporting a large range…
Standalone industrial fuses incorporates rejection feature
Omni Pro Electronics has announced its addition of two Circuit Protection Fuses from Opti-Fuse. The OptiFuse Series of UL Class M and Class CC Midget Fuses are designed for Industrial and High-Power Applications. OptiFuse’s UL Class M (UL 248–4) fuses are intended for overcurrent protection in equipment that requires no branch circuit protection or that has […]
Mouser co-sponsors FIRST Robotics Championship
Mouser Electronics, Inc. is continuing its co-sponsorship of the FIRST Robotics Competition, which inspires innovation and fosters well-rounded life capabilities in tens of thousands of young people every year. Mouser will be the exclusive sponsor of the Hall of Fame at the 2023 FIRST Championship, April 19-21 in Houston. The Hall of Fame honors the […]
DC axial fans now available in smaller frame sizes, expanded airflow ratings
CUI Devices’ Thermal Management Group announced the continued expansion of its dc fans and blowers product lines with new smaller frame sizes. CUI Devices’ dc axial fans now offer frame sizes as small as 20 x 20 x 6 mm, along with expanded airflow ratings from 0.33 to 382 CFM. Its centrifugal blowers also offer smaller frame sizes now down to 35 […]
Contactors switch high-voltage DC from lithium batteries
TDK Corporation presents HVC27 (B88269X*), its new generation of high-voltage contactors that can safely and reliably switch off continuous DC currents of 300 A to 500 A and operating DC voltages of up to 1000 V in lithium-ion batteries in 20 ms or less, depending on the type. This is made possible by the gas-filled […]
IoT antennas connect to 4G and 5G networks
Quectel Wireless Solutions announces the launch of an exciting line-up of antennas designed to meet a wide spectrum of requirements: YEMN926J1A: This state-of-the-art 9-in-1 5G screw mount combo antenna is at the forefront of technology. It offers superior performance for 5G networks and is designed with a screw mount for easy installation. YECW000N1A: This external…
Battery-life-boosting ICs extend life of non-rechargeable Li-ion coin cells
Nexperia has just introduced the NBM7100 and NBM5100, revolutionary new types of battery life boosting ICs designed to extend the life of a typical non-rechargeable lithium coin cell battery by up to 10x compared to competing solutions while also increasing its peak output current capability by up to 25x compared to what a typical coin…
Fuses qualified to AEC-Q-200 Rev E
Littelfuse, Inc. announced the release of its AEC-Q200 Rev E Qualified Fuses, specifically designed for the demanding circuit protection needs of compact automotive electronics and electric vehicle (EV) applications. The new product portfolio includes a range of thin film fuses, Nano2 fuses, PICO fuses, and cartridge fuses, all certified to meet the AEC-Q200 Rev E […]
Schottky rectifiers boast low 0.88 mm profile and wettable flanks
Vishay Intertechnology, Inc. introduced five new series of 60 V, 100 V, and 150 V surface-mount Trench MOS Barrier Schottky (TMBS) rectifiers in the low profile DFN3820A package with wettable flanks. Providing space-saving, high-efficiency solutions for commercial, industrial, energy, and automotive applications, the VxNL63, VxNM63, VxN103, VxNM103, and VxNM153 each offer best-in-class current ratings up […]
Optical NoC processor designed for domain-specific AI workloads
Lightelligence introduced a new big data interconnect paradigm with the launch of Hummingbird, the world’s first Optical Network-on-Chip (oNOC) processor designed for domain-specific artificial intelligence (AI) workloads. Hummingbird utilizes advanced vertically stacked packaging technologies to integrate a photonic chip and an electronic chip into one single package serving as the communications network for data centers […]