Raltron has developed an ultra-wide band parabolic antenna series that provides continuous coverage for frequencies ranging from 600 MHz to 6.5 GHz. Supporting 2G, 3G, 4G and 5G, the RGP Series of antennas works on all worldwide cellular bands for voice and data including LTE, CDMA, GSM, UMTS, AWS and more. Ideal for use as […]
Analog IC Tips
Chip sockets provide 75-GHz bandwidth for 0.25-mm-pitch devices
A new 0.25-pitch socket uses a high-performance elastomer capable of 75 GHz with low inductance and capable of working in a wide temperature range. The 1280 WLCSP socket is designed for a 10×8-mm package size and operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. The contact resistance is […]
EDA FastSPICE, analog/mixed-signal platforms work with new process technologies
Mentor, a Siemens business, announced that its industry-leading Calibre nmPlatform and Analog FastSPICE (AFS) custom and analog/mixed-signal (AMS) circuit verification platform are now qualified for Samsung Foundry’s newest process technologies. Customers can now use these offerings on Samsung’s 5/4-nanometer FinFET processes for the verification and sign-off of production tapeouts for their most advanced IC designs. […]
MEMS analog microphone sport high dynamic range, low power consumption
TDK introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port […]
Digital Step Attenuators support 5G frequency demands
pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its digital step attenuator (DSA) portfolio with two new high-performance DSAs, PE43610 and PE43614. Featuring industry-leading attenuation accuracy, the PE43610 and PE43614 DSAs support the entire 9 kHz–13 GHz and 9 kHz–45 GHz frequency ranges, respectively. Ideal for 5G test-and-measurement applications, these DSAs exemplify pSemi’s […]
PCB CAD software includes signal integrity, power integrity, IBIS-AMI simulation capabilities
Zuken announces the availability of eCADSTAR release 2020. With the new release, available configurations of Zuken’s new internet connected PCB design platform, eCADSTAR, have been extended to include new modules for signal integrity, power integrity and IBIS-AMI simulation. The new modules eCADSTAR Signal Integrity, eCADSTAR Signal Integrity Advanced, eCADSTAR Power Integrity and eCADSTAR IBIS-AMI complement […]
Spice program upgrades help verify large, post-layout analog designs
Mentor, a Siemens business, announced significant advances in the Analog FastSPICE Platform with the introduction of Analog FastSPICE eXTreme technology for nanometer-scale verification of large, post-layout analog designs. Analog FastSPICE eXTreme includes revolutionary technology that can substantially boost simulation performance, while helping maintain the foundry-certified accuracy required for nanometer-scale analog verification. Analog FastSPICE eXTreme is especially […]
MEMs design automation platform includes enhanced modeling capabilities
Coventor, a Lam Research Company, announced the immediate availability of CoventorMP 1.3 – the newest version of its MEMS design automation platform. With added MEMS+ features, performance improvements, and new capabilities, CoventorMP 1.3 addresses the need to quickly and easily design highly complex MEMS devices and improve the performance and reliability of next-generation MEMS devices in […]
Extreme temperature sockets facilitate testing 216-lead quad flat pack devices
A new Stamped spring pin socket addresses high-performance requirements for testing 216-lead Quad flat packs – CBT-QFE-3021. The contactor used in the CBT-QFE-3021 socket is a stamped-spring pin with 14-g actuation force per lead and cycle life of 125,000+ insertions. The self inductance of the contactor is 0.88 nH, insertion loss is < 1 dB […]
Class D audio, Gallium-Nitride versus Silicon – Virtual Roundtable (part 2 of 2)
In this second part of EEWorld’s “virtual roundtable” discussion on Class D audio, our panelists delve into the impact that the emergence of gallium-nitride (GaN) is having on Class D designs: Where are silicon devices still dominant? What are the performance benefits of using GaN in Class D amplifiers? And what are the anticipated future […]